Display panel, display apparatus, and method of manufacturing display apparatus

ABSTRACT

A display panel including a penetrating portion includes a substrate including a first region and a second region, which are spaced apart from each other with the penetrating portion provided therebetween, and a display element arranged on the substrate and including a first display element overlapping the first region and a second display element overlapping the second region, wherein a first side surface of the substrate that corresponds to an edge of the first region, and a second side surface of the substrate that corresponds to an edge of the second region, define at least portions of the penetrating portion, and an interval between the first side surface and the second side surface from an upper surface of the substrate, the upper surface facing the display element, is less than an interval between the first side surface and the second side surface from a lower surface of the substrate that does not face the display element.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2020-0182420, filed on Dec. 23, 2020, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Embodiments/implementations of the invention relate generally to adisplay panel, a display apparatus, and a method of manufacturing thedisplay apparatus.

Background

Electronic devices based on mobility are widely used. Recently, tabletpersonal computers (PCs), in addition to small-sized electronic devicessuch as mobile phones, have been widely used as mobile electronicdevices. Such mobile electronic devices may include display apparatusesto provide various functions, for example, visual information to a usersuch as an image or a video.

Recently, flexible display apparatuses that are bendable, foldable, orrollable have been studied and developed. In addition, studies anddevelopment on stretchable display apparatuses capable of changing invarious shapes or display apparatuses capable of displaying an imagewhile being bent at a corner are being actively conducted.

Also, various functions provided onto or associated with displayapparatuses are being added. For example, display apparatuses includinga component area that performs various functions while displaying animage are being studied.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Devices constructed/methods according to embodiments of the inventionand implementations of those embodiments are capable of providing aflexible display apparatus that is capable of being bent, rolled, orfolded, and that has improved reliability.

Embodiments disclosed herein provide a display panel, a displayapparatus, and a method of manufacturing the display apparatus, in whichthe flexibility of a display panel is increased and reliability isenhanced.

Additional features of the inventive concepts will be set forth in partin the description which follows and, in part, will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to an embodiment, a display panel includes a penetratingportion, the display panel includes a substrate including a first regionand a second region, which are spaced apart from each other with thepenetrating portion provided therebetween, and a display elementarranged on the substrate and including a first display elementoverlapping the first region and a second display element overlappingthe second region, wherein a first side surface of the substrate thatcorresponds to an edge of the first region, and a second side surface ofthe substrate that corresponds to an edge of the second region,respectively define at least first and second portions of thepenetrating portion, and an interval between the first side surface andthe second side surface closest to an upper surface of the substratethat faces the display element, is less than an interval between thefirst side surface and the second side surface closest to a lowersurface of the substrate, the lower surface being opposite to the uppersurface of the substrate and does not face the substrate.

The substrate may include a first base layer and a first barrier layerarranged on the first base layer, and the first side surface and thesecond side surface may respectively include a first inclined surface ofthe first base layer and a second inclined surface of the first baselayer.

The first base layer may further include an upper surface of the firstbase layer that faces the display element, a lower surface of the firstbase layer that is opposite to the upper surface of the first base layerand connected to the first inclined surface, and a first surfaceconnected to the upper surface of the first base layer and the firstinclined surface and crossing the first inclined surface and the uppersurface of the first base layer.

The first base layer may further include an upper surface of the firstbase layer that faces the display element, and a lower surface of thefirst base layer that is opposite to the upper surface of the first baselayer and connected to the first inclined surface, wherein the firstinclined surface may be connected to the upper surface of the first baselayer.

The substrate may further include a second base layer and second barrierlayer, which cover the first barrier layer, wherein the second baselayer may contact at least a portion of the first base layer.

The first base layer may include a first base pattern overlapping thefirst region and a second base pattern overlapping the second region andspaced apart from the first base pattern, the first barrier layer mayinclude a first barrier pattern arranged on the first base pattern and asecond barrier pattern arranged on the first base layer and spaced apartfrom the first barrier pattern, and a shortest distance between thefirst barrier pattern and the second barrier pattern may be less than ashortest distance between the first base pattern and the second basepattern.

A distance between the first inclined surface and the second inclinedsurface may decrease in a direction from a lower surface of the firstbase layer towards an upper surface of the first base layer.

The display panel may further include an encapsulation layer coveringthe display element and including at least one inorganic encapsulationlayer and at least one organic encapsulation layer, wherein the at leastone organic encapsulation layer may include a first organicencapsulation layer region and a second organic encapsulation layerregion separated each other based on the penetrating portion beingdisposed therebetween.

The first region may include a first center region, a first connectionregion extending from the first center region in a first direction, anda second connection region extending in a second direction crossing thefirst direction, and one of the first connection region and the secondconnection region may extend from the first center region to the secondregion.

The substrate may include a front display area, a first side displayarea extending from the front display area in a first direction, asecond side display area extending from the front display area in asecond direction crossing the first direction, and a corner display areaarranged between the first side display area and the second side displayarea, the first region and the second region may at least partiallyoverlap the corner display area, and the first region and the secondregion may extend in a direction away from the front display area.

According to another embodiment, a display apparatus includes asubstrate including a component area including a transmission area, anda display area surrounding at least a portion of the component area, adisplay element arranged on the component area and spaced apart from thetransmission area, and a component overlapping the component area,wherein the substrate further includes a first base layer and a firstbarrier layer arranged on the first base layer, the first base layerincludes an inclined surface defining a groove that overlaps thetransmission area and faces the component, and a thickness of the firstbase layer in the groove is less than a thickness of the first baselayer in the display area.

According to another embodiment, a method of manufacturing a displayapparatus includes preparing a support substrate including a firstconcave portion and a second concave portion, forming, on the supportsubstrate, a substrate overlapping the first concave portion and thesecond concave portion, forming, on the substrate, a first pixelelectrode overlapping the first concave portion and a second pixelelectrode overlapping the second concave portion, and detaching thesubstrate from the support substrate.

The forming of the substrate may include forming a first base layer thatfills the first concave portion and the second concave portion, andforming a first barrier layer on the first base layer.

The method may further include forming a first base pattern arranged onthe first concave portion and a second base pattern arranged on thesecond concave portion and spaced apart from the first base pattern byremoving at least a portion of the first base layer.

The forming of the first barrier layer may include forming a firstbarrier pattern overlapping the first concave portion and a secondbarrier pattern overlapping the second concave portion and spaced apartfrom the first barrier pattern.

The method may further include forming a second base layer to contactthe first base layer.

The preparing of the support substrate may include forming the firstconcave portion and the second concave portion on an upper surface ofthe support substrate.

The method may further include removing a portion of the substrate thatoverlaps a first upper surface of the support substrate arranged betweenthe first concave portion and the second concave portion.

The first concave portion may include a first center portion, a firstconnection portion extending from the first center portion in a firstdirection, and a second connection portion extending in a seconddirection crossing the first direction, and one of the first connectionportion and the second connection portion may extend from the firstcenter portion towards the second concave portion.

The support substrate may further include a front concave portionintegrated with the first concave portion and the second concaveportion, and the first concave portion and the second concave portionmay extend in a direction away from the front concave portion.

It is to be understood that both the foregoing general description andthe following detailed description are illustrative and explanatory andare intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIGS. 1A, 1B, and 1C are cross-sectional views for describing a methodof manufacturing a substrate according to a first embodiment constructedaccording to principles of the invention.

FIG. 2A is a cross-sectional view for describing a method ofmanufacturing a substrate, according to a second embodiment.

FIG. 2B is a cross-sectional view for describing a method ofmanufacturing a substrate, according to a third embodiment.

FIGS. 3A, 3B, 3C, and 3D are cross-sectional views for describing amethod of manufacturing a substrate, according to a fourth embodiment.

FIG. 4 is a cross-sectional view for describing a method ofmanufacturing a substrate, according to a fifth embodiment.

FIGS. 5A, 5B, and 5C are cross-sectional views for describing a methodof manufacturing a substrate, according to a sixth embodiment.

FIG. 6 is a cross-sectional view of a display apparatus according to anembodiment.

FIG. 7A is a plan view of a display panel according to an embodiment.

FIG. 7B is an enlarged view of a display panel according to anembodiment.

FIG. 7C is a plan view of a display panel elongated in a first directionand a second direction, according to an embodiment.

FIG. 8 is an equivalent circuit diagram of a pixel circuit applicable toa display panel.

FIG. 9 is a cross-sectional view of a display panel according to anembodiment.

FIG. 10A is a plan view for describing a method of manufacturing adisplay apparatus, according to an embodiment.

FIGS. 10B, 10C, 10D, and 10E are cross-sectional views for describing amethod of manufacturing a display apparatus according to an embodiment.

FIG. 11 is a cross-sectional view of a display panel according toanother embodiment.

FIG. 12 is a cross-sectional view for describing a method ofmanufacturing a display apparatus according to another embodiment.

FIG. 13 is a cross-sectional view of a display panel according toanother embodiment.

FIG. 14 is a cross-sectional view for describing a method ofmanufacturing a display apparatus according to another embodiment.

FIG. 15 is a perspective view of a display apparatus according to anembodiment.

FIGS. 16A, 16B, and 16C are cross-sectional views of a displayapparatus, according to embodiments.

FIG. 17 is a plan view of a display panel according to an embodiment.

FIG. 18 is an enlarged view of a corner of a display panel according toan embodiment.

FIG. 19 is a plan view of a body area and an extending area according toan embodiment.

FIG. 20 is a cross-sectional view of a display panel according to anembodiment.

FIG. 21A is a plan view for describing a method of manufacturing adisplay apparatus according to an embodiment.

FIGS. 21B, 21C, and 21D are cross-sectional views for describing amethod of manufacturing a display apparatus according to an embodiment.

FIG. 22 is a perspective view of a display apparatus according to anembodiment of the disclosure.

FIG. 23 is a cross-sectional view of a display apparatus according to anembodiment.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various embodiments may bepracticed without these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areshown in block diagram form in order to avoid unnecessarily obscuringvarious embodiments. Further, various embodiments may be different, butdo not have to be exclusive. For example, specific shapes,configurations, and characteristics of an embodiment may be used orimplemented in another embodiment without departing from the inventiveconcepts.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing features of varying detail of some ways in whichthe inventive concepts may be implemented in practice. Therefore, unlessotherwise specified, the features, components, modules, layers, films,panels, regions, and/or aspects, etc. (hereinafter individually orcollectively referred to as “elements”), of the various embodiments maybe otherwise combined, separated, interchanged, and/or rearrangedwithout departing from the inventive concepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. For the purposes of thisdisclosure, “at least one of X, Y, and Z” and “at least one selectedfrom the group consisting of X, Y, and Z” may be construed as X only, Yonly, Z only, or any combination of two or more of X, Y, and Z, such as,for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the term“below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionaland/or exploded illustrations that are schematic illustrations ofidealized embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments disclosed herein should not necessarily beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. In this manner, regions illustrated in the drawings maybe schematic in nature and the shapes of these regions may not reflectactual shapes of regions of a device and, as such, are not necessarilyintended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

A display apparatus is an apparatus for displaying a moving image or astill image, and may be used as a display screen of not only portableelectronic devices, such as a mobile phone, a smartphone, a tabletpersonal computer (PC), a mobile communication terminal, an electronicnotebook, an electronic book, a portable multimedia player (PMP), anavigation device, and an ultra mobile PC (UMPC), but also variousproducts, such as a television, a laptop computer, a monitor, abillboard, and Internet of things (IoT). Also, a display apparatusaccording to an embodiment may be used for wearable devices, such as asmart watch, a watch phone, a glasses-type display, and a head mounteddisplay (HMD). In addition, a display apparatus according to anembodiment may be used as a panel of a vehicle, a center informationdisplay (CID) arranged on a center fascia or dashboard of a vehicle, aroom mirror display replacing a side mirror of a vehicle, or a displayarranged on a rear surface of a front seat, as entertainment for a backseat of a vehicle.

The display apparatus may be manufactured by forming a multiple layerson a substrate. Such a substrate of the display apparatus may requirevarious thicknesses depending on requirements. For example, when thesubstrate needs to be cut, the substrate may be manufactured such that aportion thereof has a small thickness and the substrate may be cut byremoving a thin portion. In this case, a time taken to etch and removethe substrate may be reduced because the thin portion of the substrateis removed. As another example, in a display apparatus including acomponent area performing various functions while displaying an image,it is required to increase the light transmittance of a transmissionarea for transmitting light. In this case, the light transmittance ofthe transmission area may be increased by reducing a thickness of asubstrate corresponding to the transmission area. Hereinafter, a methodof forming a substrate having various thicknesses will be described indetail.

FIGS. 1A through 1C are cross-sectional views for describing a method ofmanufacturing a substrate 100 according to a first embodimentconstructed according to principles of the invention.

Referring to FIG. 1A, a support substrate SS including a first concaveportion CCP1 and a second concave portion CCP2 may be prepared. Thesupport substrate SS may include an upper surface SSUS and a lowersurface SSLS. The lower surface SSLS of the support substrate SS may bea surface opposite to the upper surface SSUS of the support substrateSS. The support substrate SS may include a material having hardness andrigidity capable of supporting a manufactured display panel, forexample, a glass material.

The first concave portion CCP1 and the second concave portion CCP2 maybe provided at the upper surface SSUS of the support substrate SS. Thefirst concave portion CCP1 and the second concave portion CCP2 may haveshapes dug in a direction from the upper surface SSUS of the supportsubstrate SS to the lower surface SSLS of the support substrate SS.According to an embodiment, the first concave portion CCP1 may bedefined to be an inclined side surface of the support substrate SS.According to an embodiment, the second concave portion CCP2 may bedefined to be an inclined side surface of the support substrate SS.

According to an embodiment, the first concave portion CCP1 and thesecond concave portion CCP2 may be spaced apart from each other. In thiscase, a first upper surface SSUS1 of the support substrate SS may bedefined between the first concave portion CCP1 and the second concaveportion CCP2.

According to an embodiment, the first concave portion CCP1 and thesecond concave portion CCP2 may be formed at the upper surface SSUS ofthe flat support substrate SS. For example, the first concave portionCCP1 and the second concave portion CCP2 may be formed by irradiating alaser beam onto the upper surface SSUS of the support substrate SS. Asanother example, the first concave portion CCP1 and the second concaveportion CCP2 may be formed by etching the upper surface SSUS of thesupport substrate SS. The etching may be wet etching. As anotherexample, the first concave portion CCP1 and the second concave portionCCP2 may be formed by irradiating a laser beam onto the upper surfaceSSUS of the support substrate SS and then etching the upper surface SSUSof the support substrate SS.

Referring to FIG. 1B, a substrate overlapping the first concave portionCCP1 and the second concave portion CCP2 may be formed on the supportsubstrate SS. According to an embodiment, a first base layer 100 a maybe formed on the support substrate SS. The first base layer 100 a mayfill the first concave portion CCP1 and the second concave portion CCP2.Accordingly, the first base layer 100 a may overlap the first concaveportion CCP1 and the second concave portion CCP2.

According to an embodiment, the first base layer 100 a may also beformed on the first upper surface SSUS1 of the support substrate SSdefined between the first concave portion CCP1 and the second concaveportion CCP2. The first base layer 100 a may be continuously arranged onthe first concave portion CCP1, the first upper surface SSUS1 of thesupport substrate SS, and the second concave portion CCP2.

An upper surface of the first base layer 100 a may be flat. According toan embodiment, a thickness of the first base layer 100 a in the firstconcave portion CCP1 may be greater than a thickness of the first baselayer 100 a on the first upper surface SSUS1 of the support substrateSS.

The first base layer 100 a may include a first region AR1 and a secondregion AR2. The first region AR1 may be a region overlapping the firstconcave portion CCP1. The first region AR1 may include a first externalregion ER1 as an edge region. At the first external region ER1, thefirst base layer 100 a may include a first inclined surface ICS1. Thefirst inclined surface ICS1 may be inclined. In FIG. 1B, the firstinclined surface ICS1 is shown to be inclined with a constant slope, butaccording to another embodiment, the first inclined surface ICS1 may beinclined slightly or it may be inclined greatly. A width of the firstbase layer 100 a in the first region AR1 may decrease in a directionfrom the upper surface SSUS of the support substrate SS to the lowersurface SSLS of the support substrate SS.

The second region AR2 may be a region overlapping the second concaveportion CCP2. The second region AR2 may include a second external regionER2 as an edge region. At the second external region ER2, the first baselayer 100 a may include a second inclined surface ICS2. The secondinclined surface ICS2 may be inclined. In FIG. 1B, the second inclinedsurface ICS2 is shown to be inclined with a constant slope, butaccording to another embodiment, the second inclined surface ICS2 may beinclined slightly or it may be inclined greatly. A width of the firstbase layer 100 a in the second region AR2 may decrease in a directionfrom the upper surface SSUS of the support substrate SS to the lowersurface SSLS of the support substrate SS.

According to an embodiment, a distance between the first inclinedsurface ICS1 and the second inclined surface ICS2 may increase in adirection from the first upper surface SSUS1 of the support substrate SSto the lower surface SSLS of the support substrate SS.

The first base layer 100 a may include a polymer resin, such aspolyether sulfone, polyarylate, polyetherimide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyimide, polycarbonate, cellulose triacetate, or cellulose acetatepropionate, or colorless polyimide (CPI). According to an embodiment,the first base layer 100 a may include a siloxane-based material.

Referring to FIG. 1C, a first barrier layer 100 b may be formed on thefirst base layer 100 a. The first barrier layer 100 b may be arranged onthe first base layer 100 a. The first barrier layer 100 b is a barrierlayer preventing penetration of an external foreign material and may bea single layer or a multi-layer including an inorganic material, such assilicon nitride (SiN_(X)), silicon oxide (SiO₂), and/or siliconoxynitride (SiON).

Next, the substrate 100 may be detached from the support substrate SS.

As such, the substrate 100 according to the first embodiment may includethe first base layer 100 a and the first barrier layer 100 b. Becausethe support substrate SS includes the first concave portion CCP1 and thesecond concave portion CCP2, a thickness of the substrate 100 may varydepending on regions. For example, a thickness 100 t 1 of the substrate100 in the first region AR1 may be greater than a thickness 100 t 2 ofthe substrate 100 between the first region AR1 and the second regionAR2. In other words, the thickness 100 t 1 of the substrate 100 in thefirst concave portion CCP1 may be greater than the thickness 100 t 2 ofthe substrate 100 in the first upper surface SSUS1 of the supportsubstrate SS.

FIG. 2A is a cross-sectional view for describing a method ofmanufacturing the substrate 100, according to a second embodiment. FIG.2B is a cross-sectional view for describing a method of manufacturingthe substrate 100, according to a third embodiment. In FIGS. 2A and 2B,like reference numerals as FIGS. 1A through 1C denote like elements, andthus redundant descriptions thereof will be omitted for ease inexplanation of these figures.

Referring to FIG. 2A, the support substrate SS including the firstconcave portion CCP1 and the second concave portion CCP2 may beprepared. Next, the substrate 100 overlapping the first concave portionCCP1 and the second concave portion CCP2 may be formed on the supportsubstrate SS.

According to an embodiment, the first base layer 100 a may be formed onthe support substrate SS and the first barrier layer 100 b may be formedon the first base layer 100 a.

Next, a second base layer 100 c may be formed on the first barrier layer100 b. The second base layer 100 c may include a polymer resin, such aspolyether sulfone, polyarylate, polyetherimide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyimide, polycarbonate, cellulose triacetate, or cellulose acetatepropionate, or CPI. According to an embodiment, the second base layer100 c may include a siloxane-based material.

Next, a second barrier layer 100 d may be formed on the second baselayer 100 c. The second barrier layer 100 d is a barrier layerpreventing penetration of an external foreign material, and may be asingle layer or a multi-layer including an inorganic material, such asSiNX, SiO2, and/or SiON.

Next, the substrate 100 may be detached from the support substrate SS.

As such, the substrate 100 according to the second embodiment mayinclude the first base layer 100 a, the first barrier layer 100 b, thesecond base layer 100 c, and the second barrier layer 100 d.

Referring to FIG. 2B, a third base layer 100 e may be formed on thesecond barrier layer 100 d. The third base layer 100 e may include apolymer resin, such as polyether sulfone, polyarylate, polyetherimide,polyethylene naphthalate, polyethylene terephthalate, polyphenylenesulfide, polyimide, polycarbonate, cellulose triacetate, or celluloseacetate propionate, or CPI. According to an embodiment, the third baselayer 100 e may include a siloxane-based material.

Next, a third barrier layer 100 f may be formed on the third base layer100 e. The third barrier layer 100 f is a barrier layer preventingpenetration of an external foreign material, and may be a single layeror a multi-layer including an inorganic material, such as SiNX, SiO2,and/or SiON.

Next, the substrate 100 may be detached from the support substrate SS.

Accordingly, the substrate 100 according to the third embodiment mayinclude the first base layer 100 a, the first barrier layer 100 b, thesecond base layer 100 c, the second barrier layer 100 d, the third baselayer 100 e, and the third barrier layer 100 f.

As such, the substrate 100 may be formed by alternately stacking a baselayer including an organic material and a barrier layer including aninorganic material. In other words, the substrate 100 may be formed byalternately stacking a plurality of base layers and a plurality ofbarrier layers.

FIGS. 3A through 3D are cross-sectional views for describing a method ofmanufacturing the substrate 100, according to a fourth embodiment. InFIGS. 3A through 3D, like reference numerals as FIGS. 1A through 1Cdenote like elements, and thus, redundant descriptions thereof will beomitted for ease in explanation of these figures.

Referring to FIGS. 3A through 3D, the support substrate SS including thefirst concave portion CCP1 and the second concave portion CCP2 may beprepared. Next, the substrate 100 overlapping the first concave portionCCP1 and the second concave portion CCP2 may be formed on the supportsubstrate SS.

Referring to FIG. 3A, the first base layer 100 a may be formed on thesupport substrate SS. The first base layer 100 a may fill the firstconcave portion CCP1 and the second concave portion CCP2.

Referring to FIG. 3B, at least a portion of the first base layer 100 amay be removed. According to an embodiment, a first base pattern 100 aP1and a second base pattern 100 aP2 may be formed. The first base pattern100 aP1 may be arranged in the first concave portion CCP1. The secondbase pattern 100 aP2 may be arranged in the second concave portion CCP2.The first base pattern 100 aP1 and the second base pattern 100 aP2 maybe spaced apart from each other.

The first upper surface SSUS1 of the support substrate SS may beexternally exposed. In other words, at least a portion of the first baselayer 100 a may be removed and thus the first upper surface SSUS1 of thesupport substrate SS may be externally exposed.

At least the portion of the first base layer 100 a may be removed bypolishing one surface of the first base layer 100 a. In this case, anupper surface of at least one of the first base pattern 100 aP1 and thesecond base pattern 100 aP2 may extend in a same direction as the uppersurface SSUS of the support substrate SS. According to an embodiment,chemical mechanical polishing (CMP) may be performed on the one surfaceof the first base layer 100 a.

Referring to FIG. 3C, the first barrier layer 100 b may be formed on thefirst base layer 100 a. The first barrier layer 100 b may include afirst barrier pattern 100 bP1 and a second barrier pattern 100 bP2,which are spaced apart from each other. The first barrier pattern 100bP1 may be formed to overlap the first region AR1. The first barrierpattern 100 bP1 may overlap the first concave portion CCP1. According toan embodiment, the first barrier pattern 100 bP1 may overlap the firstexternal region ER1 and extend from the first external region ER1 to thefirst upper surface SSUS1 of the support substrate SS.

The second barrier pattern 100 bP2 may be formed to overlap the secondregion AR2. The second barrier pattern 100 bP2 may overlap the secondconcave portion CCP2. According to an embodiment, the second barrierpattern 100 bP2 may overlap the second external region ER2 and extendfrom the second external region ER2 to the first upper surface SSUS1 ofthe support substrate SS.

According to an embodiment, a shortest distance dis1 between the firstbarrier pattern 100 bP1 and the second barrier pattern 100 bP2 may beless than a shortest distance dis2 between the first base pattern 100aP1 and the second base pattern 100 aP2. According to an embodiment, theshortest distance dis2 between the first base pattern 100 aP1 and thesecond base pattern 100 aP2 may be defined to be a width of the firstupper surface SSUS1 of the support substrate SS.

Referring to FIG. 3D, the second base layer 100 c may be formed on thefirst barrier layer 100 b. The second base layer 100 c may be formed onthe first barrier pattern 100 bP1, the second barrier pattern 100 bP2,and the first upper surface SSUS1 of the support substrate SS. Thesecond base layer 100 c may fill between the first barrier pattern 100bP1 and the second barrier pattern 100 bP2. Accordingly, the second baselayer 100 c may be separated from the first base layer 100 a. Thesubstrate 100 according to the fourth embodiment may prevent or reducepenetration of an external foreign material through the first base layer100 a and the second base layer 100 c.

The second barrier layer 100 d may be formed on the second base layer100 c. Next, the substrate 100 may be detached from the supportsubstrate SS.

FIG. 4 is a cross-sectional view for describing a method ofmanufacturing the substrate 100, according to a fifth embodiment. InFIG. 4, like reference numerals as FIGS. 3A through 3D denote likeelements, and thus, redundant descriptions thereof will be omitted forease in explanation of these figures.

Referring to FIG. 4, the support substrate SS including the firstconcave portion CCP1 and the second concave portion CCP2 may beprepared. Next, the substrate 100 overlapping the first concave portionCCP1 and the second concave portion CCP2 may be formed on the supportsubstrate SS.

The first base layer 100 a may be formed on the support substrate SS.Next, the first base pattern 100 aP1 and the second base pattern 100 aP2may be formed by removing at least a portion of the first base layer 100a. Next, the first barrier layer 100 b including the first barrierpattern 100 bP1 and the second barrier pattern 100 bP2, which are spacedapart from each other, may be formed. Then, the second base layer 100 cmay be formed on the first barrier layer 100 b and the second barrierlayer 100 d may be formed on the second base layer 100 c.

Next, the third base layer 100 e may be formed on the second barrierlayer 100 d. Next, the third barrier layer 100 f may be formed on thethird base layer 100 e. Next, the substrate 100 may be detached from thesupport substrate SS.

As such, the substrate 100 may be formed by alternately stacking a baselayer including an organic material and a barrier layer including aninorganic material. In other words, the substrate 100 may be formed byalternately stacking a plurality of base layers and a plurality ofbarrier layers.

FIGS. 5A through 5C are cross-sectional views for describing a method ofmanufacturing the substrate 100, according to a sixth embodiment. InFIGS. 5A through 5C, like reference numerals as FIGS. 3A through 3Ddenote like elements, and thus, redundant descriptions thereof will beomitted for ease in explanation of these figures.

Referring to FIGS. 5A through 5C, the support substrate SS including thefirst concave portion CCP1 and the second concave portion CCP2 may beprepared. Next, the substrate 100 overlapping the first concave portionCCP1 and the second concave portion CCP2 may be formed on the supportsubstrate SS.

Referring to FIG. 5A, the first base layer 100 a may be formed on thesupport substrate SS. The first base layer 100 a may fill the firstconcave portion CCP1 and the second concave portion CCP2. Next, thefirst base pattern 100 aP1 and the second base pattern 100 aP2 may beformed by removing at least a portion of the first base layer 100 a.

Referring to FIG. 5B, the first barrier layer 100 b may be formed on thefirst base layer 100 a. The first barrier layer 100 b may include thefirst barrier pattern 100 bP1 and the second barrier pattern 100 bP2,which are spaced apart from each other. The first barrier pattern 100bP1 may be formed to overlap the first region AR1. The first barrierpattern 100 bP1 may overlap the first concave portion CCP1. According toan embodiment, the first barrier pattern 100 bP1 may be spaced apartfrom the first upper surface SSUS1 of the support substrate SS. Thefirst barrier pattern 100 bP1 may not overlap the first upper surfaceSSUS1 of the support substrate SS. According to an embodiment, the firstbarrier pattern 100 bP1 may be spaced apart from the first externalregion ER1. Accordingly, a portion of the first base pattern 100 aP1 maybe externally exposed.

The second barrier pattern 100 bP2 may be formed to overlap the secondregion AR2. The second barrier pattern 100 bP2 may overlap the secondconcave portion CCP2. According to an embodiment, the second barrierpattern 100 bP2 may be spaced apart from the first upper surface SSUS1of the support substrate SS. The second barrier pattern 100 bP2 may notoverlap the first upper surface SSUS1 of the support substrate SS.According to an embodiment, the second barrier pattern 100 bP2 may bespaced apart from the second external region ER2. Accordingly, a portionof the second base pattern 100 aP2 may be externally exposed.

According to an embodiment, the shortest distance dis1 between the firstbarrier pattern 100 bP1 and the second barrier pattern 100 bP2 may begreater than the shortest distance dis2 between the first base pattern100 aP1 and the second base pattern 100 aP2.

Referring to FIG. 5C, the second base layer 100 c may be formed on thefirst barrier layer 100 b. The second base layer 100 c may be formed onthe first barrier pattern 100 bP1, the second barrier pattern 100 bP2,and the first upper surface SSUS1 of the support substrate SS. Thesecond base layer 100 c may fill between the first barrier pattern 100bP1 and the second barrier pattern 100 bP2. The second base layer 100 cmay contact the first base layer 100 a. The substrate 100 according tothe sixth embodiment may have an enhanced adhesive force because thefirst base layer 100 a including an organic material and the second baselayer 100 c including an organic material contact each other.

Next, the substrate 100 may be detached from the support substrate SS.

The substrate 100 described above may be used to manufacture astretchable display apparatus capable of being changed in variousshapes. Alternatively, the substrate 100 may be used to manufacture adisplay apparatus in which an image is displayed while being bent at acorner. Alternatively, the substrate 100 may be used to manufacture adisplay apparatus having a component area performing various functionswhile displaying an image. The display apparatus will be described indetail below.

FIG. 6 is a cross-sectional view of a display apparatus 1 according toan embodiment.

Referring to FIG. 6, the display apparatus 1 may include a display panel10 and a cover window 20. The cover window 20 may be arranged on thedisplay panel 10.

The display panel 10 may display an image. The display panel 10 mayinclude a plurality of pixels and may display an image by using theplurality of pixels.

The plurality of pixels may each include a display element. The displaypanel 10 may be an organic light-emitting display panel using an organiclight-emitting diode including an organic emission layer. Alternatively,the display panel 10 may be a light-emitting diode display panel using alight-emitting diode (LED). A size of the light-emitting diode (LED) maybe in micro-scale or nano-scale. For example, the light-emitting diodemay be a micro light-emitting diode. Alternatively, the light-emittingdiode may be a nanorod light-emitting diode. The nanorod light-emittingdiode may include gallium nitride (GaN). According to an embodiment, acolor conversion layer may be arranged on the nanorod light-emittingdiode. The color conversion layer may include quantum dots.Alternatively, the display panel 10 may be a quantum dot light-emittingdisplay panel using a quantum dot light-emitting diode including aquantum dot emission layer. Alternatively, the display panel 10 may bean inorganic light-emitting display panel using an inorganiclight-emitting device including an inorganic semiconductor. Hereinafter,a case in which the display panel 10 is an organic light-emittingdisplay panel using an organic light-emitting diode as a display elementwill be described in detail.

The cover window 20 may protect the display panel 10. According to anembodiment, the cover window 20 may protect the display panel 10 bybeing easily bent according to an external force without causing a crackor the like. The cover window 20 may be attached to the display panel 10by a transparent adhesive member, such as an optically clear adhesive(OCA) film.

The cover window 20 may include glass, sapphire, or plastic. The coverwindow 20 may be, for example, ultra-thin glass (UTG) or CPI. Accordingto an embodiment, the cover window 20 may have a structure in which aflexible polymer layer is arranged on one surface of a glass substrateor may include only a polymer layer.

FIG. 7A is a plan view of the display panel 10 according to anembodiment. FIG. 7B is an enlarged view of the display panel 10according to an embodiment. FIG. 7C is a plan view of the display panel10 elongated in a first direction and a second direction, according toan embodiment. FIGS. 7B and 7C are enlarged views of a region A of thedisplay panel 10 of FIG. 7A.

Referring to FIG. 7A, the display panel 10 may include the substrate 100and a multi-layer film arranged on the substrate 100. The substrate 100may be the substrate 100 according to one of the first through sixthembodiments.

Referring to FIG. 7B, the display panel 10 may include a penetratingportion PNP. The penetrating portion PNP may penetrate an upper surfaceand a lower surface of the display panel 10. Accordingly, the substrate100 and the multi-layer film on the substrate 100 may not be arranged inthe penetrating portion PNP. Flexibility of the display panel 10 may beenhanced as the display panel 10 includes the penetrating portion PNP.

The display panel 10 may include the substrate 100 and a pixel PXarranged on the substrate 100. The substrate 100 may include the firstregion AR1 and the second region AR2. The first region AR1 and thesecond region AR2 may be spaced apart from each other. The first regionAR1 and the second region AR2 may be spaced apart from each other by afirst distance d1 or a second distance d2.

The first region AR1 may include the first external region ER1 as anedge region. The first external region ER1 may extend along an edge ofthe first region AR1. The first external region ER1 may include a firstside surface RS1 that is an edge of the first region AR1.

The second region AR2 may include the second external region ER2 as anedge region. The second external region ER2 may extend along an edge ofthe second region AR2. The second external region ER2 may include asecond side surface RS2 that is an edge of the second region AR2.

According to an embodiment, the first side surface RS1 and the secondside surface RS2 may respectively include a first inclined surface and asecond inclined surface. This will be described later in more detail.

There may be pluralities of the first regions AR1 and second regionsAR2. The plurality of first regions AR1 and the plurality of secondregions AR2 may form lattice patterns repeatedly arranged in the firstdirection and the second direction. Here, the first direction and thesecond direction may cross each other. For example, the first directionand the second direction may form an acute angle. As another example,the first direction and the second direction may form an obtuse angle ora right angle. Hereinafter, a case in which the first direction (forexample, an x-axis direction or −x-axis direction) and the seconddirection (for example, a y-axis direction or −y-axis direction) form aright angle will be described in detail.

According to an embodiment, the first region AR1 and the second regionAR2 may be spaced apart from each other in the first direction (forexample, the x-axis direction or −x-axis direction). According toanother embodiment, the first region AR1 and the second region AR2 maybe spaced apart from each other in the second direction (for example,the y-axis direction or −y-axis direction).

The first region AR1 and the second region AR2 may be spaced apart fromeach other with the penetrating portion PNP therebetween. According toan embodiment, a component of the display panel 10 may not be arrangedbetween the first region AR1 and the second region AR2.

The first region AR1 and the second region AR2 may each include a centerregion and a connection region. The connection region may extend betweenneighboring center regions. According to an embodiment, each centerregion may be connected to four connection regions. The four connectionregions connected to one center region extend in different directions,and each connection region may be connected to another center regionarranged adjacent to the one center region.

According to an embodiment, the first region AR1 may include a firstcenter region CR1, a first connection region CNR1, and a secondconnection region CNR2. The first connection region CNR1 may extend inthe first direction (for example, the x-axis direction or −x-axisdirection). The second connection region CNR2 may extend in the seconddirection (for example, the y-axis direction or −y-axis direction)crossing the first direction. The first center region CR1, the firstconnection region CNR1, and the second connection region CNR2 may beintegrated.

According to an embodiment, the second region AR2 may include a secondcenter region CR2, a third connection region CNR3, and a fourthconnection region CNR4. The third connection region CNR3 may extend inthe first direction (for example, the x-axis direction or −x-axisdirection). The fourth connection region CNR4 may extend in the seconddirection (for example, the y-axis direction or −y-axis direction)crossing the first direction. The second center region CR2, the thirdconnection region CNR3, and the fourth connection region CNR4 may beintegrated.

One of the first connection region CNR1 and the second connection regionCNR2 may extend from the first center region CR1 to the second regionAR2. According to an embodiment, the first connection region CNR1 mayextend towards the second center region CR2. In this case, the firstconnection region CNR1 and the third connection region CNR3 may contacteach other and be integrated.

The first side surface RS1 of the substrate 100, which is an edge of thefirst region AR1, and the second side surface RS2 of the substrate 100,which is an edge of the second region AR2, may define at least a portionof the penetrating portion PNP. According to an embodiment, a sidesurface CRS1 of the first center region CR1, a side surface CNRS1 of thefirst connection region CNR1, a side surface CNRS3 of the thirdconnection region CNR3, and a side surface CRS2 of the second centerregion CR2 may define at least a portion of the penetrating portion PNP.According to an embodiment, a side surface CNRS2 of the secondconnection region CNR2, the side surface CRS1 of the first center regionCR1, the side surface CNRS1 of the first connection region CNR1, theside surface CNRS3 of the third connection region CNR3, the side surfaceCRS2 of the second center region CR2, and a side surface CNRS4 of thefourth connection region CNR4 may define at least a portion of thepenetrating portion PNP.

A portion of one center region and connection regions extendingtherefrom may be defined as one base unit U. The base unit U may berepeatedly arranged in the first direction (for example, the x-axisdirection or −x-axis direction) and the second direction (for example,the y-axis direction or −y-axis direction), and the substrate 100 may beunderstood as being provided as the repeatedly arranged base units U areconnected to each other. The two adjacent base units U may be symmetric.For example, two base units U adjacent in a left-and-right direction inFIG. 7B may be symmetric laterally based on a symmetric axis locatedtherebetween and parallel to the y-axis direction. Similarly, two baseunits U adjacent in a top-and-bottom direction in FIG. 7B may besymmetric longitudinally based on a symmetric axis located therebetweenand parallel in the x-axis direction.

The base units U adjacent to each other among the plurality of baseunits U, for example, the four base units U shown in FIG. 7B, form aclosed loop CL therebetween, and the closed loop CL may define aseparated region V that is an empty space. The separated region V may bedefined by the closed loop CL including edges of a plurality of centerregions and edges of a plurality of connection regions. Each separatedregion V may penetrate the upper surface and the lower surface of thesubstrate 100. The separated region V may overlap the penetratingportion PNP of the display panel 10.

According to an embodiment, an angle θ between the side surface CRS2 ofthe second center region CR2 and the side surface CNRS3 of the thirdconnection region CNR3 may be an acute angle. When an external force ofpulling the substrate 100 is applied, an angle θ′ (θ′>θ) between theside surface CRS2 of the second center region CR2 and the side surfaceCNRS3 of the third connection region CNR3 may increase as shown in FIG.7C, an area or shape of a separated region V may change, and a locationof a center region may also change.

When the external force is applied, each center region may rotate in acertain angle via the change of the angle θ′, the increase in the areaof the separated region V′, and/or the change in the shape of theseparated region V′. Intervals between the center regions, for example,a first distance d1′ and a second distance d2′, may vary depending onlocations, according to the rotation of each center region.

When the external force of pulling the substrate 100 is applied, stressmay be concentrated in the side surface CRS2 of the second center regionCR2 and the side surface CNRS3 of the third connection region CNR3, andthus, the closed loop CL defining the separated region V may include acurve to prevent damage to the substrate 100.

The pixel PX may overlap at least portions of the first region AR1 andsecond region AR2. According to an embodiment, each pixel PX may overlapat least a portion of each center region.

According to an embodiment, the pixel PX may include a red sub-pixel Pr,a green sub-pixel Pg, and a blue sub-pixel Pb. According to anotherembodiment, the pixel PX may include the red sub-pixel Pr, the greensub-pixel Pg, the blue sub-pixel Pb, and a white sub-pixel. Hereinafter,a case in which the pixel PX overlapping the first region AR1 and thesecond region AR2 includes the red sub-pixel Pr, the green sub-pixel Pg,and the blue sub-pixel Pb will be described in detail.

According to an embodiment, a sub-pixel is a display element and emit acertain light color by using an organic light-emitting diode. In thepresent specification, the sub-pixel denotes an emission regionrealizing an image in a minimum unit. When the organic light-emittingdiode is employed as the display element, the emission region may bedefined by an opening of a pixel-defining layer described below. Theorganic light-emitting diode may emit, for example, red, green, or bluelight.

A connecting wire may be arranged in the first connection region CNR1through fourth connection region CNR4, and may supply power or a signalto the pixel PX arranged in the first center region CR1 and the secondcenter region CR2.

FIG. 8 is an equivalent circuit diagram of a pixel circuit PC applicableto a display panel.

Referring to FIG. 8, the pixel circuit PC may be connected to a displayelement, for example, an organic light-emitting diode OLED.

The pixel circuit PC may include a driving thin-film transistor T1, aswitching thin-film transistor T2, and a storage capacitor Cst. Also,the organic light-emitting diode OLED may emit red, green, or blue lightor may emit red, green, blue, or white light.

The switching thin-film transistor T2 is connected to a scan line SL anda data line DL, and may transmit, to the driving thin-film transistorT1, a data signal or data voltage input from the data line DL based on ascan signal or switching voltage input from the scan line SL. Thestorage capacitor Cst is connected to the switching thin-film transistorT2 and a driving voltage line PL, and may store a voltage correspondingto a difference between a voltage received from the switching thin-filmtransistor T2 and a first power voltage ELVDD supplied to the drivingvoltage line PL.

The driving thin-film transistor T1 is connected to the driving voltageline PL and the storage capacitor Cst, and may be configured to controla driving current flowing through the organic light-emitting diode OLEDfrom the driving voltage line PL in response to a voltage value storedin the storage capacitor Cst. The organic light-emitting diode OLED mayemit a light of a certain luminance according to the driving current. Anopposing electrode of the organic light-emitting diode OLED may receivea second power voltage ELVSS.

In FIG. 8, the pixel circuit PC includes two thin-film transistors andone storage capacitor, but the pixel circuit PC may include three ormore thin-film transistors.

FIG. 9 is a cross-sectional view of the display panel 10 according to anembodiment. FIG. 9 is a cross-sectional view of the display panel 10taken along a line B-B′ of FIG. 7B.

Referring to FIG. 9, the display panel 10 may include the penetratingportion PNP. Components of the display panel 10 may not be arranged inthe penetrating portion PNP. The penetrating portion PNP may be definedas an edge of the components of the display panel 10. For example, thepenetrating portion PNP may be defined as an edge of the substrate 100.

The display panel 10 may include the substrate 100, a buffer layer 111,the pixel circuit PC, an insulating layer IL, the organic light-emittingdiode OLED as a display element, and an encapsulation layer 300. Thesubstrate 100 may include the first region AR1 and the second regionAR2, which are spaced apart from each other with the penetrating portionPNP therebetween.

The first side surface RS1 of the substrate 100, which is an edge of thefirst region AR1, and the second side surface RS2 of the substrate 100,which is an edge of the second region AR2, may define at least a portionof the penetrating portion PNP. According to an embodiment, a spacebetween the first side surface RS1 and the second side surface RS2,which face each other, may be defined as the separated region V of thesubstrate 100. The separated region V may overlap the penetratingportion PNP.

The substrate 100 may include an upper surface 100US facing the organiclight-emitting diode OLED and a lower surface 100LS opposite to theupper surface 100US. A first interval int1 between the first sidesurface RS1 and the second side surface RS2 from the upper surface 100USof the substrate 100 may be less than a second interval int2 between thefirst side surface RS1 and the second side surface RS2 from the lowersurface 100LS of the substrate 100. The first interval int1 may be aninterval from a first point 100P1, where the upper surface 100US of thesubstrate 100 and the first side surface RS1 contact each other, to asecond point 100P2, where the upper surface 100US of the substrate 100and the second side surface RS2 contact each other. The second intervalint2 may be an interval from a third point 100P3, where the lowersurface 100LS of the substrate 100 and the first side surface RS1contact each other, to a fourth point 100P4, where the lower surface100LS of the substrate 100 and the second side surface RS2 contact eachother.

The substrate 100 may include a base layer and a barrier layer on thebase layer. According to an embodiment, the substrate 100 may includethe first base layer 100 a, the first barrier layer 100 b, the secondbase layer 100 c, and the second barrier layer 100 d, which aresequentially stacked on each other in the stated order. According to anembodiment, the first base layer 100 a may include the first inclinedsurface ICS1 and the second inclined surface ICS2.

The first side surface RS1 and the second side surface RS2 mayrespectively include the first inclined surface ICS1 and the secondinclined surface ICS2. The first inclined surface ICS1 may overlap thefirst external region ER1 that is an edge region of the first regionAR1. The second inclined surface ICS2 may overlap the second externalregion ER2 that is an edge region of the second region AR2.

According to an embodiment, the first inclined surface ICS1 may beconnected to the lower surface 100LS of the substrate 100 at the firstregion AR1. The second inclined surface ICS2 may be connected to thelower surface 100LS of the substrate 100 at the second region AR2.According to an embodiment, the distance between the first inclinedsurface ICS1 and the second inclined surface ICS2 may decrease in adirection from the lower surface 100LS of the substrate 100 to the uppersurface 100US of the substrate 100. In other words, the substrate 100may include an inverted tapered shape based on the penetrating portionPNP. Hereinafter, because the second region AR2 is similar to the firstregion AR1, the first region AR1 will be mainly described in detail.

The first base layer 100 a may include an upper surface 100 aUS, a lowersurface 100 aLS, the first inclined surface ICS1, and a first surfaceSS1 of the first base layer 100 a.

The upper surface 100 aUS of the first base layer 100 a may face theorganic light-emitting diode OLED. The lower surface 100 aLS of thefirst base layer 100 a may be a surface opposite to the upper surface100 aUS of the first base layer 100 a. The first inclined surface ICS1may contact the lower surface 100 aLS of the first base layer 100 a.

The first surface SS1 of the first base layer 100 a may cross the uppersurface 100 aUS of the first base layer 100 a and the first inclinedsurface ICS1. The first surface SS1 of the first base layer 100 a maycontact the upper surface 100 aUS of the first base layer 100 a and thefirst inclined surface ICS1. For example, one side of the first surfaceSS1 of the first base layer 100 a may contact the upper surface 100 aUSof the first base layer 100 a, and the other side of the first surfaceSS1 of the first base layer 100 a may contact the first inclined surfaceICS1. The first surface SS1 of the first base layer 100 a may be asurface formed via an etching process.

At least one of the first base layer 100 a and the second base layer 100c may include a polymer resin, such as polyethersulfone, polyarylate,polyetherimide, polyethylene naphthalate, polyethylene terephthalate,polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate,cellulose acetate propionate, or CPI. According to an embodiment, atleast one of the first base layer 100 a and the second base layer 100 cmay include a siloxane-based material.

The first barrier layer 100 b and second barrier layer 100 d are barrierlayers preventing penetration of an external foreign material, and mayeach be a single layer or a multi-layer including an inorganic material,such as SiNX, SiO2, and/or SiON.

The buffer layer 111 may be arranged on the substrate 100. The bufferlayer 111 may include an inorganic insulating material, such as SiNX,SiON, or SiO2, and may be a single layer or multi-layer including theinorganic insulating material. According to an embodiment, the bufferlayer 111 may be omitted.

The pixel circuit PC may include the driving thin-film transistor T1,the switching thin-film transistor T2, and the storage capacitor Cst.The driving thin-film transistor T1, the switching thin-film transistorT2, and the storage capacitor Cst may be arranged on the buffer layer111. The driving thin-film transistor T1 may include a firstsemiconductor layer Act1, a first gate electrode GE1, a first sourceelectrode SE1, and a first drain electrode DE1. The switching thin-filmtransistor T2 may include a second semiconductor layer Act2, a secondgate electrode GE2, a second source electrode SE2, and a second drainelectrode DE2. The storage capacitor Cst may include a lower electrodeCE1 and an upper electrode CE2.

The insulating layer IL may include a first gate insulating layer 112, asecond gate insulating layer 113, an interlayer insulating layer 114, afirst inorganic layer PVX1, a first organic insulating layer 115, asecond organic insulating layer 116, and a second inorganic layer PVX2.

The first semiconductor layer Act1 may be arranged on the buffer layer111. The first semiconductor layer Act1 may include polysilicon.Alternatively, the first semiconductor layer Act1 may include amorphoussilicon, an oxide semiconductor, or an organic semiconductor. The firstsemiconductor layer Act1 may include a channel region, and drain regionand a source region, which are arranged on both sides of the channelregion, respectively.

The first gate electrode GE1 may overlap the channel region. The firstgate electrode GE1 may include a low-resistance metal material. Thefirst gate electrode GE1 may include a conductive material includingmolybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and maybe formed in a multi-layer or single layer including the conductivematerial.

The first gate insulating layer 112 between the first semiconductorlayer Act1 and the first gate electrode GE1 may include an inorganicinsulating material, such as SiO2, SiNX, SiON, aluminum oxide (Al2O3),titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2),and/or zinc oxide (ZnO).

The second gate insulating layer 113 may be provided to cover the firstgate electrode GE1. Like the first gate insulating layer 112, the secondgate insulating layer 113 may include an inorganic insulating material,such as SiO2, SiNX, SiON, Al2O3, TiO2, Ta2O5, HfO2, and/or ZnO.

The upper electrode CE2 may be arranged on the second gate insulatinglayer 113. The upper electrode CE2 may overlap the first gate electrodeGE1 therebelow. Here, the upper electrode CE2 and the first gateelectrode GE1 of the driving thin-film transistor T1, which overlap withthe second gate insulating layer 113 therebetween, may form the storagecapacitor Cst. In other words, the first gate electrode GE1 of thedriving thin-film transistor T1 may function as the lower electrode CE1of the storage capacitor Cst.

As such, the storage capacitor Cst and the driving thin-film transistorT1 may overlap. According to some embodiments, the storage capacitor Cstmay not overlap the driving thin-film transistor T1.

The upper electrode CE2 may include aluminum (Al), platinum (Pt),palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni),neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum(Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be asingle layer or multi-layer including such a material.

The interlayer insulating layer 114 may cover the upper electrode CE2.The interlayer insulating layer 114 may include SiO2, SiNX, SiON, Al2O3,TiO2, Ta2O5, HfO2, or ZnO. The interlayer insulating layer 114 may be asingle layer or multi-layer including the inorganic insulating materialdescribed above.

The first drain electrode DE1 and the first source electrode SE1 mayeach be located on the interlayer insulating layer 114. The first drainelectrode DE1 and the first source electrode SE1 may include a materialhaving good conductivity. The first drain electrode DE1 and the firstsource electrode SE1 may include a conductive material including Mo, Al,Cu, or Ti, and may be formed in a multi-layer or single layer includingthe conductive material. According to an embodiment, the first drainelectrode DE1 and the first source electrode SE1 may have a multi-layerstructure of Ti/Al/Ti.

The second semiconductor layer Act2, the second gate electrode GE2, thesecond drain electrode DE2, and the second source electrode SE2 arerespectively similar to the first semiconductor layer Act1, the firstgate electrode GE1, the first drain electrode DE1, and the first sourceelectrode SE1, and thus, detailed descriptions thereof are omitted.

The first organic insulating layer 115 may cover the first drainelectrode DE1 and the first source electrode SE1. The first organicinsulating layer 115 may include an organic insulating material, such asa general-purpose polymer, for example, polymethylmethacrylate (PMMA) orpolystyrene (PS), a polymer derivate having a phenol-based group, anacrylic-based polymer, an imide-based polymer, an aryl ether-basedpolymer, an amide-based polymer, a fluorine-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, or a blendthereof.

A connection electrode CM may be arranged on the first organicinsulating layer 115. Here, the connection electrode CM may be connectedto the first drain electrode DE1 or the first source electrode SE1 via acontact hole of the first organic insulating layer 115. The connectionelectrode CM may include a material having good conductivity. Theconnection electrode CM may include a conductive material including Mo,Al, Cu, or Ti, and may be formed in a multi-layer or single layerincluding the conductive material. According to an embodiment, theconnection electrode CM may have a multi-layer structure of Ti/Al/Ti.

The second organic insulating layer 116 may cover the connectionelectrode CM. The second organic insulating layer 116 may include anorganic insulating material, such as a general-purpose polymer, forexample, PMMA or PS, a polymer derivate having a phenol-based group, anacrylic-based polymer, an imide-based polymer, an aryl ether-basedpolymer, an amide-based polymer, a fluorine-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, or a blendthereof.

The first organic insulating layer 115 and the second organic insulatinglayer 116 may include a hole HL. According to an embodiment, the hole HLmay be provided as a hole of the first organic insulating layer 115 anda hole of the second organic insulating layer 116 overlap each other.According to another embodiment, the hole HL may be provided at thesecond organic insulating layer 116. In this case, an upper surface ofthe first organic insulating layer 115 may be exposed by the hole of thesecond organic insulating layer 116. Hereinafter, a case in which thehole HL is provided at the first organic insulating layer 115 and thesecond organic insulating layer 116 will be mainly described in detail.

According to an embodiment, the first inorganic layer PVX1 may bearranged between the interlayer insulating layer 114 and the firstorganic insulating layer 115. The first inorganic layer PVX1 may coverthe first source electrode SE1, the first drain electrode DE1, thesecond source electrode SE2, and the second drain electrode DE2.According to an embodiment, the first inorganic layer PVX1 may include acontact hole such that the first source electrode SE1 or the first drainelectrode DE1 is electrically connected to the connection electrode CM.

According to another embodiment, the first inorganic layer PVX1 may bearranged between the first organic insulating layer 115 and the secondorganic insulating layer 116. In this case, the first inorganic layerPVX1 may cover the connection electrode CM. At least a portion of thefirst inorganic layer PVX1 may be exposed by the hole HL. The firstinorganic layer PVX1 may be a single-layer film or multi-layer filmincluding an inorganic material, such as SiNX and/or SiO2.

The organic light-emitting diode OLED may be arranged on the secondorganic insulating layer 116. The organic light-emitting diode OLED mayinclude a first organic light-emitting diode OLED1 and a second organiclight-emitting diode OLED2. The first organic light-emitting diode OLED1may overlap the first region AR1, as a first display element. The secondorganic light-emitting diode OLED2 may overlap the second region AR2, asa second display element.

The first organic light-emitting diode OLED1 may include a first pixelelectrode 211A, an intermediate layer 212, and an opposing electrode213. The second organic light-emitting diode OLED2 may include a secondpixel electrode 211B, the intermediate layer 212, and the opposingelectrode 213. The first pixel electrode 211A and the second pixelelectrode 211B may each be connected to the connection electrode CM viaa contact hole of the second organic insulating layer 116.

The first pixel electrode 211A and the second pixel electrode 211B mayinclude a conductive oxide, such as indium tin oxide (ITO), indium zincoxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium galliumoxide (IGO), or aluminum zinc oxide (AZO). According to anotherembodiment, the first pixel electrode 211A and the second pixelelectrode 211B may include a reflective film including silver (Ag),magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au),nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compoundthereof. According to another embodiment, the first pixel electrode 211Aand the second pixel electrode 211B may further include a film includingITO, IZO, ZnO, or In2O3 on/below the reflective film.

A pixel-defining layer 118 having an opening 1180P exposing each of acenter portion of the first pixel electrode 211A and a center portion ofthe second pixel electrode 211B may be arranged on the first pixelelectrode 211A and the second pixel electrode 211B. The pixel-defininglayer 118 may include an organic insulating material and/or an inorganicinsulating material. The opening 1180P may define an emission region ofa light emitted from the organic light-emitting diode OLED. For example,a width of the opening 1180P may correspond to a width of the emissionregion. Also, the width of the opening 1180P may correspond to a widthof a sub-pixel.

The intermediate layer 212 may be arranged on the pixel-defining layer118. The intermediate layer 212 may include an emission layer 212 barranged at the opening 1180P of the pixel-defining layer 118. Theemission layer 212 b may include a high-molecular weight organicmaterial or low-molecular weight organic material, which emit a light ofcertain color.

A first functional layer 212 a and a second functional layer 212 c maybe respectively arranged below and on the emission layer 212 b. Thefirst functional layer 212 a may include, for example, a hole transportlayer (HTL) or may include an HTL and a hole injection layer (HIL). Thesecond functional layer 212 c is a component arranged on the emissionlayer 212 b and may be optional. The second functional layer 212 c mayinclude an electron transport layer (ETL) and/or an electron injectionlayer (EIL). Like the opposing electrode 213, the first functional layer212 a and/or the second functional layer 212 c may be a common layerformed to entirely cover the substrate 100.

The opposing electrode 213 may include a conductive material with a lowwork function. The opposing electrode 213 may include a(semi-)transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir,Cr, lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, theopposing electrode 213 may further include a layer including ITO, IZO,ZnO, or In2O3, on the (semi-)transparent layer including the abovematerial.

According to some embodiments, a capping layer may be further arrangedon the opposing electrode 213. The capping layer may include lithiumfluoride (LiF), an inorganic material, and/or an organic material.

The second inorganic layer PVX2 may be arranged between the organiclight-emitting diode OLED and the second organic insulating layer 116.The second inorganic layer PVX2 may include a plurality of inorganicpatterns that are spaced apart from each other on the second organicinsulating layer 116. The second inorganic layer PVX2 may include aprotruding tip PT that protrudes in a center direction of the hole HL.Accordingly, a lower portion of the protruding tip PT may be exposed atthe hole HL. In other words, the hole HL may have an undercut structure.The second inorganic layer PVX2 may be a single-layer film ormulti-layer film including an inorganic material, such as SiNX and/orSiO2.

The hole HL and the protruding tip PT of the second inorganic layer PVX2may be a structure for disconnecting the first functional layer 212 aand the second functional layer 212 c. According to an embodiment, thefirst functional layer 212 a, the second functional layer 212 c, and theopposing electrode 213 may be formed on an entire surface of thesubstrate 100. In this case, the first functional layer 212 a and thesecond functional layer 212 c may include an organic material, andexternal oxygen, moisture, or the like may be introduced from thepenetrating portion PNP to the first region AR1 and/or the second regionAR2 through at least one of the first functional layer 212 a and thesecond functional layer 212 c. Such oxygen or moisture may damage theorganic light-emitting diode OLED. The hole HL and the protruding tip PTof the second inorganic layer PVX2 may disconnect the first functionallayer 212 a and the second functional layer 212 c, and a firstfunctional layer pattern and a second functional layer pattern, whichare separated from each other, may be arranged inside the hole HL.Accordingly, the introduction of moisture or oxygen from the penetratingportion PNP to the organic light-emitting diode OLED may be preventedand damage to the organic light-emitting diode OLED may be prevented.

A first dam portion DAM1 and a second dam portion DAM2 may be arrangedon the second inorganic layer PVX2. The first dam portion DAM1 and thesecond dam portion DAM2 may protrude in a thickness direction of thesubstrate 100 from the second inorganic layer PVX2. The first damportion DAM1 and the second dam portion DAM2 may be arranged adjacent tothe penetrating portion PNP.

The first dam portion DAM1 may be arranged between the penetratingportion PNP and the first organic light-emitting diode OLED1. Accordingto an embodiment, the first dam portion DAM1 may surround the firstorganic light-emitting diode OLED1. The first dam portion DAM1 may bearranged closer to the penetrating portion PNP than the hole HL. Thefirst dam portion DAM1 may include a first pattern layer 118D1 and afirst upper pattern layer 119D1. According to an embodiment, the firstpattern layer 118D1 may include a same material as the pixel-defininglayer 118. The first upper pattern layer 119D1 may include an organicinsulating material and/or an inorganic insulating material.

The second dam portion DAM2 may be arranged between the penetratingportion PNP and the second organic light-emitting diode OLED2. Accordingto an embodiment, the second dam portion DAM2 may surround the secondorganic light-emitting diode OLED2. The second dam portion DAM2 may bearranged closer to the penetrating portion PNP than the hole HL. Thesecond dam portion DAM2 may include a second pattern layer 118D2 and asecond upper pattern layer 119D2. According to an embodiment, the secondpattern layer 118D2 may include a same material as the pixel-defininglayer 118 and first pattern layer 118D1. The pixel-defining layer 118,the first pattern layer 118D1, and the second pattern layer 118D2 may besimultaneously formed. The second upper pattern layer 119D2 may includean organic insulating material and/or an inorganic insulating material.The second upper pattern layer 119D2 may include a same material as thefirst upper pattern layer 119D1.

The encapsulation layer 300 may be arranged on the opposing electrode213. According to an embodiment, the encapsulation layer 300 may includeat least one inorganic encapsulation layer and at least one organicencapsulation layer. According to an embodiment, FIG. 9 illustrates thatthe encapsulation layer 300 includes a first inorganic encapsulationlayer 310, an organic encapsulation layer 320, and a second inorganicencapsulation layer 330, which are sequentially stacked in the statedorder.

The first inorganic encapsulation layer 310 may cover the organiclight-emitting diode OLED. The first inorganic encapsulation layer 310may entirely and continuously cover the substrate 100. The firstinorganic encapsulation layer 310 may cover the first organiclight-emitting diode OLED1, the hole HL, the first dam portion DAM1, thesecond dam portion DAM2, and the second organic light-emitting diodeOLED2. The first inorganic encapsulation layer 310 may contact theprotruding tip PT of the second inorganic layer PVX2. The firstinorganic encapsulation layer 310 may contact the first inorganic layerPVX1. Accordingly, the moisture or oxygen may be prevented from beingintroduced from the penetrating portion PNP to the organiclight-emitting diode OLED through a layer including an organic material.

The organic encapsulation layer 320 may be arranged on the firstinorganic encapsulation layer 310. The organic encapsulation layer 320may overlap the first organic light-emitting diode OLED1 and the secondorganic light-emitting diode OLED2, and may fill the hole HL. Accordingto an embodiment, the organic encapsulation layer 320 may be separatedbased on the penetrating portion PNP. Because the first dam portion DAM1and the second dam portion DAM2 protrude in the thickness direction ofthe substrate 100 from an upper surface of the second inorganic layerPVX2, a flow of the organic encapsulation layer 320 may be controlled.

The second inorganic encapsulation layer 330 may cover the organicencapsulation layer 320. The second inorganic encapsulation layer 330may entirely and continuously cover the substrate 100. The secondinorganic encapsulation layer 330 may contact the first inorganicencapsulation layer 310 on the first dam portion DAM1 and the second damportion DAM2. Accordingly, the organic encapsulation layer 320 may beseparated by the first dam portion DAM1 and the second dam portion DAM2.

The first inorganic encapsulation layer 310 and the second inorganicencapsulation layer 330 may each include one or more organic materialsfrom among Al₂O₃, TiO₂, Ta₂O₅, HfO₂, ZnO, SiO₂, SiN_(X), and SiON. Theorganic encapsulation layer 320 may include a polymer-based material.Examples of the polymer-based material may include an acryl-based resin,an epoxy-based resin, polyimide, and polyethylene. According to anembodiment, the organic encapsulation layer 320 may include acrylate.

A touch electrode layer may be arranged on the encapsulation layer 300,and an optical functional layer may be arranged on the touch electrodelayer. The touch electrode layer may obtain coordinate informationaccording to an external input, for example, a touch event. The opticalfunctional layer may reduce reflectance of a light (external light)incident from the outside towards a display apparatus, and/or enhancecolor purity of a light emitted from the display apparatus. According toan embodiment, the optical functional layer may include a retarderand/or a polarizer. The retarder may be a film type or liquid crystalcoating type, and may include a λ/2 retarder and/or a λ/4 retarder. Thepolarizer may also be a film type or a liquid crystal coating type. Thefilm type may include an elongated synthetic resin film, and the liquidcrystal coating type may include liquid crystals arranged in a certainarrangement. The retarder and the polarizer may further include aprotection film.

According to another embodiment, the optical functional layer mayinclude a black matrix and color filters. The color filters may bearranged considering colors of lights emitted from sub-pixels of thedisplay apparatus, respectively. The color filters may each include red,green, or blue pigment or dye. Alternatively, the color filters may eachfurther include a quantum dot in addition to the above pigment or dye.Alternatively, some of the color filters may not include the pigment ordye, and may include scattered particles such as titanium oxide.

According to another embodiment, the optical functional layer mayinclude a destructive interference structure. The destructiveinterference structure may include a first reflective layer and a secondreflective layer arranged on different layers. A first reflective lightand a second reflective light reflected respectively from the firstreflective layer and the second reflective layer may be destructivelyinterfered, and accordingly, reflectance of an external light may bereduced.

An adhesive member may be arranged between the touch electrode layer andthe optical functional layer. A general adhesive member known in therelated art may be employed as the adhesive member without limitation.The adhesive member may be a pressure sensitive adhesive (PSA).

According to an embodiment, the penetrating portion PNP may be definedin the display panel 10 and enhance flexibility of the display panel 10.The penetrating portion PNP may be defined by the first side surface RS1of the substrate 100, which is the edge of the first region AR1, and thesecond side surface RS2 of the substrate 100, which is the edge of thesecond region AR2.

According to an embodiment, the first interval int1 may be less than thesecond interval int2. Also, the first side surface RS1 and the secondside surface RS2 may respectively include the first inclined surfaceICS1 and the second inclined surface ICS2. Accordingly, the substrate100 may be easily detached from a support substrate and reliability ofthe display panel 10 may be enhanced.

Components formed in the separated region V may need to be removed whilethe display panel 10 is manufactured so as to form the penetratingportion PNP of the display panel 10. For example, portions of thesubstrate 100 and insulating layer IL, which overlap the separatedregion V, may be removed via etching. When the thickness of thesubstrate 100 is uniform, an amount of the substrate 100 to be removedin the separated region V may increase, and thus a processing time maybe increased. According to an embodiment of the disclosure, the firstinterval int1 may be less than the second interval int2, and thesubstrate 100 includes the first inclined surface ICS1 and the secondinclined surface ICS2. Accordingly, the amount of substrate 100 etchedin the separated region V may be reduced, thereby reducing theprocessing time of the display panel 10.

FIG. 10A is a plan view for describing a method of manufacturing adisplay apparatus according to an embodiment. FIGS. 10B through 10E arecross-sectional views for describing a method of manufacturing a displayapparatus according to an embodiment. FIGS. 10B through 10E arecross-sectional views showing the support substrate SS taken along aline C-C′ of FIG. 10A, and a multi-layer film formed on the supportsubstrate SS.

Referring to FIG. 10A, the support substrate SS including the firstconcave portion CCP1 and the second concave portion CCP2 may beprepared. According to an embodiment, pluralities of the first concaveportions CCP1 and second concave portions CCP2 may be provided. Theplurality of first concave portions CCP1 and the plurality of secondconcave portions CCP2 may each form lattice patterns repeatedly arrangedin the first direction (for example, the x-axis direction or −x-axisdirection) and the second direction (for example, y-axis direction or−y-axis direction).

According to an embodiment, the first concave portion CCP1 and thesecond concave portion CCP2 may be spaced apart from each other in thefirst direction (for example, the x-axis direction or −x-axisdirection). According to an embodiment, the first concave portion CCP1and the second concave portion CCP2 may be spaced apart from each otherin the second direction (for example, the y-axis direction or −y-axisdirection).

The first concave portion CCP1 and the second concave portion CCP2 mayeach include a center portion and a connection portion. The connectionportion may extend between neighboring center portions. According to anembodiment, each center portion may be connected to four connectionportions. The four connection portions connected to one center portionextend in different directions, and each connection portion may beconnected to another center portion arranged adjacent to the one centerportion.

According to an embodiment, the first concave portion CCP1 may include afirst center portion CP1, a first connection portion CNP1, and a secondconnection portion CNP2. The first connection portion CNP1 may extend inthe first direction (for example, the x-axis direction or −x-axisdirection). The second connection portion CNP2 may extend in the seconddirection (for example, the y-axis direction or −y-axis direction). Thefirst center portion CP1, the first connection portion CNP1, and thesecond connection portion CNP2 may be integrated.

According to an embodiment, the second concave portion CCP2 may includea second center portion CP2, a third connection portion CNP3, and afourth connection portion CNP4. The third connection portion CNP3 mayextend in the first direction (for example, the x-axis direction or−x-axis direction). The fourth connection portion CNP4 may extend in thesecond direction (for example, the y-axis direction or −y-axisdirection). The second center portion CP2, the third connection portionCNP3, and the fourth connection portion CNP4 may be integrated.

One of the first connection portion CNP1 and the second connectionportion CNP2 may extend from the first center portion CP1 to the secondconcave portion CCP2. According to an embodiment, the first connectionportion CNP1 may extend towards the second center portion CP2. In thiscase, the first connection portion CNP1 and the third connection portionCNP3 may contact each other and be integrated.

The substrate 100 overlapping the first concave portion CCP1 and thesecond concave portion CCP2 may be formed on the support substrate SS.The substrate 100 may include the first region AR1, the second regionAR2, and the separated region V. The first region AR1 may overlap thefirst concave portion CCP1. The first region AR1 may include the firstexternal region ER1 as an edge region. The first external region ER1 mayextend along an edge of the first region AR1. The first external regionER1 may contact the separated region V.

The second region AR2 may overlap the second concave portion CCP2. Thesecond region AR2 may include the second external region ER2 as an edgeregion. The second external region ER2 may extend along an edge of thesecond region AR2. The second external region ER2 may contact theseparated region V.

Referring to FIG. 10B, the substrate 100 may include the first baselayer 100 a, the first barrier layer 100 b, the second base layer 100 c,and the second barrier layer 100 d, which are sequentially stacked oneach other in the stated order. According to an embodiment, thesubstrate 100 may be the substrate 100 according to the secondembodiment described with reference to FIG. 2A. According to anotherembodiment, the substrate 100 may be the substrate 100 according to thefirst embodiment described with reference to FIGS. 1A through 1C.According to another embodiment, the substrate 100 may be the substrate100 according to the third embodiment described with reference to FIG.2B. Hereinafter, a case in which the substrate 100 is the substrate 100according to the second embodiment described with reference to FIG. 2Awill be mainly described.

The buffer layer 111, the insulating layer IL, and the pixel circuit PCmay be formed on the second barrier layer 100 d. The pixel circuit PCmay include the driving thin-film transistor T1, the switching thin-filmtransistor T2, and the storage capacitor Cst.

The insulating layer IL may be separated from the separated region V.According to an embodiment, the buffer layer 111, the first gateinsulating layer 112, the second gate insulating layer 113, and theinterlayer insulating layer 114 may each include a hole overlapping theseparated region V.

The first organic insulating layer 115, the connection electrode CM, andthe second organic insulating layer 116 may be formed on the firstinorganic layer PVX1. According to an embodiment, the first organicinsulating layer 115 and the second organic insulating layer 116 may beseparated from the separated region V. According to another embodiment,at least one of the first organic insulating layer 115 and the secondorganic insulating layer 116 may overlap the separated region V.

The second inorganic layer PVX2 may be formed on the second organicinsulating layer 116. The second inorganic layers PVX2 may be formed tobe spaced apart from each other on the second organic insulating layer116.

The first pixel electrode 211A and the second pixel electrode 211B maybe formed on the second inorganic layer PVX2. The first pixel electrode211A may be arranged on the first region AR1. The first pixel electrode211A may overlap the first concave portion CCP1. The second pixelelectrode 211B may be arranged on the second region AR2. The secondpixel electrode 211B may overlap the second concave portion CCP2. Thefirst pixel electrode 211A and the second pixel electrode 211B may beformed on the substrate 100 and spaced apart from each other.

Next, the pixel-defining layer 118, the first pattern layer 118D1, andthe second pattern layer 118D2 may be formed. The pixel-defining layer118 may be formed while covering each of an edge of the first pixelelectrode 211A and an edge of the second pixel electrode 211B. Thepixel-defining layer 118 may include the opening 1180P exposing each ofa center portion of the first pixel electrode 211A and a center portionof the second pixel electrode 211B.

The pixel-defining layer 118, the first pattern layer 118D1, and thesecond pattern layer 118D2 may be simultaneously formed. According to anembodiment, the pixel-defining layer 118, the first pattern layer 118D1,and the second pattern layer 118D2 may be formed by patterning anorganic layer after forming the organic layer entirely on the substrate100. In this case, the pixel-defining layer 118, the first pattern layer118D1, and the second pattern layer 118D2 may include a same material.

The first upper pattern layer 119D1 and the second upper pattern layer119D2 may be respectively formed on the first pattern layer 118D1 andthe second pattern layer 118D2. According to an embodiment, the firstupper pattern layer 119D1 and the second upper pattern layer 119D2 maybe formed by patterning an organic layer after forming the organic layerentirely on the substrate 100. In this case, the first upper patternlayer 119D1 and the second upper pattern layer 119D2 may include a samematerial.

The first pattern layer 118D1 and the first upper pattern layer 119D1may form a first dam portion DAM1, and the second pattern layer 118D2and the second upper pattern layer 119D2 may form a second dam portionDAM2.

According to an embodiment, the support substrate SS may include thefirst concave portion CCP1 and the second concave portion CCP2, and thesubstrate 100 may overlap the first concave portion CCP1 and the secondconcave portion CCP2. Accordingly, a thickness of the substrate 100 mayvary according to regions. For example, the thickness 100 t 1 of thesubstrate 100 in the first region AR1 may be greater than the thickness100 t 2 of the substrate 100 between the first region AR1 and the secondregion AR2.

Referring to FIG. 10C, a portion of the substrate 100 overlapping thefirst upper surface SSUS1 of the support substrate SS may be removed. Inother words, a portion of the substrate 100 overlapping the separatedregion V may be removed. Accordingly, the first upper surface SSUS1 ofthe support substrate SS may be externally exposed. In other words, thepenetrating portion PNP may be formed. The first side surface RS1 of thesubstrate 100, which is an edge of the first region AR1, and the secondside surface RS2 of the substrate 100, which is an edge of the secondregion AR2, may define at least a portion of the penetrating portionPNP. According to an embodiment, the substrate 100 may be removed via anetching process. The etching process may be, for example, a dry etchingprocess.

According to an embodiment of the disclosure, the support substrate SSmay include the first concave portion CCP1 and the second concaveportion CCP2, and the substrate 100 may overlap the first concaveportion CCP1 and the second concave portion CCP2. Accordingly, an amountof substrate 100 etched in the separated region V may be reduced. Forexample, an amount of substrate 100 etched by a depth SSdp of the firstconcave portion CCP1 and/or the second concave portion CCP2 may bereduced, and a processing time of the display panel and/or the displayapparatus may be reduced.

According to an embodiment, the hole HL may be formed at the firstorganic insulating layer 115 and the second organic insulating layer116. According to an embodiment, the second organic insulating layer 116arranged below the second inorganic layer PVX2 may be over-etched.Accordingly, the first organic insulating layer 115 and the secondorganic insulating layer 116 may have undercut structures. In this case,a lower surface of an end portion of the second inorganic layer PVX2 maybe exposed. In other words, a lower surface of the protruding tip PT ofthe second inorganic layer PVX2, which overlap the hole HL, may beexposed.

Referring to FIG. 10D, the intermediate layer 212 and the opposingelectrode 213 may be formed on the substrate 100. Accordingly, the firstorganic light-emitting diode OLED1 and the second organic light-emittingdiode OLED2 may be formed. Because the second inorganic layer PVX2includes the protruding tip PT protruding in a center direction of thehole HL, the first functional layer 212 a, the second functional layer212 c, and the opposing electrode 213 may be disconnected based on thehole HL. Also, the lower surface of the protruding tip PT of the secondinorganic layer PVX2 may not contact the first functional layer 212 a,the second functional layer 212 c, and the opposing electrode 213.Accordingly, introduction of external moisture and foreign material tothe organic light-emitting diode OLED through at least one of the firstfunctional layer 212 a and the second functional layer 212 c may beprevented or reduced, and the reliability of the display panel may beenhanced.

Next, the encapsulation layer 300 may be formed.

According to an embodiment, the first inorganic encapsulation layer 310covering the organic light-emitting diode OLED may be formed. The firstinorganic encapsulation layer 310 may entirely and continuously coverthe substrate 100. The first inorganic encapsulation layer 310 may coverthe first organic light-emitting diode OLED1, the hole HL, the first damportion DAM1, the second dam portion DAM2, and the second organiclight-emitting diode OLED2. The first inorganic encapsulation layer 310may contact the protruding tip PT of the second inorganic layer PVX2.The first inorganic encapsulation layer 310 may contact the firstinorganic layer PVX1. Accordingly, moisture or oxygen may be preventedfrom being introduced from the penetrating portion PNP to the organiclight-emitting diode OLED through a layer including an organic material.

Next, the organic encapsulation layer 320 may be formed on the firstinorganic encapsulation layer 310. The organic encapsulation layer 320may overlap the first organic light-emitting diode OLED1 and the secondorganic light-emitting diode OLED2, and may fill the hole HL. Accordingto an embodiment, the organic encapsulation layer 320 may be separatedbased on the penetrating portion PNP.

Next, the second inorganic encapsulation layer 330 covering the organicencapsulation layer 320 may be formed. The second inorganicencapsulation layer 330 may entirely and continuously cover thesubstrate 100. The second inorganic encapsulation layer 330 may contactthe first inorganic encapsulation layer 310 on the first dam portionDAM1 and the second dam portion DAM2. Accordingly, the organicencapsulation layer 320 may be separated by the first dam portion DAM1and the second dam portion DAM2.

Next, the touch electrode layer and/or the optical functional layer maybe formed on the encapsulation layer 300. When the touch electrode layerand/or the optical functional layer are formed, processes of forming,exposing and developing a photoresist on the encapsulation layer 300 maybe performed. Such processes may be performed after the penetratingportion PNP is formed. Accordingly, the photoresist may be coated notonly on the first region AR1 and the second region AR2, but also on theseparated region V. The photoresist coated on the separated region V maybe removed via a developing process, and a process difficulty level mayincrease due to a depth of the penetrating portion PNP defined from anupper surface of the encapsulation layer 300 to the upper surface SSUSof the support substrate SS.

According to an embodiment, the support substrate SS may include thefirst concave portion CCP1 overlapping the first region AR1 and thesecond concave portion CCP2 overlapping the second region AR2.Accordingly, the depth of the penetrating portion PNP may be definedfrom the upper surface of the encapsulation layer 300 to the first uppersurface SSUS1 of the support substrate SS.

Compared to a case where the support substrate SS does not include thefirst concave portion CCP1 and the second concave portion CCP2, a heightfrom the upper surface SSUS of the support substrate SS to the uppersurface of the encapsulation layer 300 may be decreased by the depthSSdp of the first concave portion CCP1 and/or the second concave portionCCP2. Accordingly, the process difficulty level caused by the depth ofthe penetrating portion PNP may be reduced. Such an effect has beendescribed based on a case where the photoresist is formed on theencapsulation layer 300, but the process difficulty level may be reducedin a similar manner when an organic layer formed on the encapsulationlayer 300 is patterned.

Referring to FIG. 10E, the substrate 100 may be detached from thesupport substrate SS. According to an embodiment, the substrate 100 maybe separated from the support substrate SS according to laser release ofirradiating a laser beam onto the substrate 100. The laser beam may beirradiated in a direction from the lower surface SSLS of the supportsubstrate SS to the upper surface SSUS of the support substrate SS.Accordingly, the laser beam may be irradiated towards the lower surface100LS of the substrate 100 facing the upper surface SSUS of the supportsubstrate SS. The laser beam may be, for example, an excimer laser beamhaving a wavelength of 308 nm or a solid ultraviolet (UV) laser beamhaving a wavelength of 343 nm or 355 nm.

The first interval int1 between the first side surface RS1 and thesecond side surface RS2 from the upper surface 100US of the substrate100 may be less than the second interval int2 between the first sidesurface RS1 and the second side surface RS2 from the lower surface 100LSof the substrate 100. The first interval int1 may be an interval fromthe first point 100P1, where the upper surface 100US of the substrate100 and the first side surface RS1 contact each other, to the secondpoint 100P2, where the upper surface 100US of the substrate 100 and thesecond side surface RS2 contact each other. The second interval int2 maybe an interval from the third point 100P3, where the lower surface 100LSof the substrate 100 and the first side surface RS1 contact each other,to the fourth point 100P4, where the lower surface 100LS of thesubstrate 100 and the second side surface RS2 contact each other. Also,the first side surface RS1 and the second side surface RS2 mayrespectively include the first inclined surface ICS1 and the secondinclined surface ICS2. Accordingly, the substrate 100 may be easilydetached from the support substrate SS.

Next, a cover window may be arranged on the encapsulation layer 300.

FIG. 11 is a cross-sectional view of the display panel 10 according toanother embodiment. FIG. 11 is a cross-sectional view of the displaypanel 10 taken along the line B-B′ of FIG. 7B. In FIG. 11, likereference numerals as FIG. 9 denote like elements, and thus, redundantdescriptions thereof will be omitted for ease in explanation of thatfigure.

Referring to FIG. 11, the display panel 10 may include the penetratingportion PNP. The display panel 10 may include the substrate 100, thebuffer layer 111, the pixel circuit PC, the insulating layer IL, theorganic light-emitting diode OLED as a display element, and theencapsulation layer 300. The substrate 100 may include the first regionAR1 and the second region AR2, which are spaced apart from each otherwith the penetrating portion PNP therebetween.

The first side surface RS1 of the substrate 100, which is an edge of thefirst region AR1, and the second side surface RS2 of the substrate 100,which is an edge of the second region AR2, may define at least a portionof the penetrating portion PNP.

The substrate 100 may include the upper surface 100US facing the organiclight-emitting diode OLED and the lower surface 100LS opposite to theupper surface 100US. The first interval int1 between the first sidesurface RS1 and the second side surface RS2 from the upper surface 100USof the substrate 100 may be less than the second interval int2 betweenthe first side surface RS1 and the second side surface RS2 from thelower surface 100LS of the substrate 100.

The substrate 100 may include a base layer and a barrier layer on thebase layer. According to an embodiment, the substrate 100 may includethe first base layer 100 a, the first barrier layer 100 b, the secondbase layer 100 c, and the second barrier layer 100 d, which aresequentially stacked on each other in the stated order. According to anembodiment, the first base layer 100 a may include the first inclinedsurface ICS1 and the second inclined surface ICS2.

The first side surface RS1 and the second side surface RS2 mayrespectively include the first inclined surface ICS1 and the secondinclined surface ICS2. The first inclined surface ICS1 may overlap thefirst external region ER1 that is an edge region of the first regionAR1. The second inclined surface ICS2 may overlap the second externalregion ER2 that is an edge region of the second region AR2.

According to an embodiment, the first inclined surface ICS1 may beconnected to the lower surface 100LS of the substrate 100 at the firstregion AR1. The second inclined surface ICS2 may be connected to thelower surface 100LS of the substrate 100 at the second region AR2.According to an embodiment, the distance between the first inclinedsurface ICS1 and the second inclined surface ICS2 may decrease in adirection from the lower surface 100LS of the substrate 100 to the uppersurface 100US of the substrate 100. In other words, the substrate 100may include an inverted tapered shape based on the penetrating portionPNP. Hereinafter, because the second region AR2 is similar to the firstregion AR1, the first region AR1 will be mainly described in detail.

The first base layer 100 a may include the upper surface 100 aUS of thefirst base layer 100 a, the lower surface 100 aLS of the first baselayer 100 a, and the first inclined surface ICS1.

The upper surface 100 aUS of the first base layer 100 a may face theorganic light-emitting diode OLED. The lower surface 100 aLS of thefirst base layer 100 a may be a surface opposite to the upper surface100 aUS of the first base layer 100 a.

The first inclined surface ICS1 may contact the lower surface 100 aLS ofthe first base layer 100 a. Also, the first inclined surface ICS1 maycontact the upper surface 100 aUS of the first base layer 100 a.

The first base layer 100 a may include the first base pattern 100 aP1and the second base pattern 100 aP2. The first base pattern 100 aP1 mayoverlap the first region AR1. The second base pattern 100 aP2 mayoverlap the second region AR2. The first base pattern 100 aP1 and thesecond base pattern 100 aP2 may be spaced apart from each other.

The first barrier layer 100 b may include the first barrier pattern 100bP1 and the second barrier pattern 100 bP2, which are spaced apart fromeach other. The first barrier pattern 100 bP1 may be arranged on thefirst base pattern 100 aP1. The second barrier pattern 100 bP2 may bearranged on the second base pattern 100 aP2.

According to an embodiment, the shortest distance dis1 between the firstbarrier pattern 100 bP1 and the second barrier pattern 100 bP2 may beless than the shortest distance dis2 between the first base pattern 100aP1 and the second base pattern 100 aP2. Accordingly, the first barrierpattern 100 bP1 and the second barrier pattern 100 bP2 may prevent orreduce penetration of an external foreign material from the first basepattern 100 aP1 and the second base pattern 100 aP2 to the organiclight-emitting diode OLED.

FIG. 12 is a cross-sectional view for describing a method ofmanufacturing a display apparatus, according to another embodiment. FIG.12 is a cross-sectional view showing the support substrate SS takenalong a line C-C′ of FIG. 10A, and a multi-layer film formed on thesupport substrate SS. In FIG. 12, like reference numerals as FIG. 10Bdenote like elements, and thus, redundant descriptions thereof will beomitted for ease in explanation of that figure.

Referring to FIG. 12, the support substrate SS including the firstconcave portion CCP1 and the second concave portion CCP2 may beprepared, and the substrate 100 may be formed to overlap the firstconcave portion CCP1 and the second concave portion CCP2.

The substrate 100 may include the first base layer 100 a, the firstbarrier layer 100 b, the second base layer 100 c, and the second barrierlayer 100 d, which are sequentially stacked on each other in the statedorder. According to an embodiment, the substrate 100 may be thesubstrate 100 according to the fourth embodiment described withreference to FIG. 3A through 3D. According to another embodiment, thesubstrate 100 may be the substrate 100 according to the fifth embodimentdescribed with reference to FIG. 5. Hereinafter, a case in which thesubstrate 100 is the substrate 100 according to the fourth embodimentdescribed with reference to FIGS. 3A through 3D will be mainlydescribed.

According to an embodiment of the disclosure, the support substrate SSmay include the first concave portion CCP1 and the second concaveportion CCP2, and the substrate 100 may overlap the first concaveportion CCP1 and the second concave portion CCP2. Accordingly, an amountof substrate 100 etched in the separated region V may be reduced. Forexample, an etched amount of the substrate 100 may be reduced by thedepth SSdp of the first concave portion CCP1 and/or the second concaveportion CCP2. In particular, when only the second base layer 100 c andthe second barrier layer 100 d are etched in the separated region V, thefirst upper surface SSUS1 of the support substrate SS may be exposed.Accordingly, the processing time of the display panel 10/displayapparatus may be reduced.

The method of manufacturing a display apparatus performed thereafter issimilar to that described with reference to FIGS. 10B through 10E, andthus details thereof will be omitted for ease in explanation of thesefigures.

FIG. 13 is a cross-sectional view of the display panel 10 according toanother embodiment. FIG. 13 is a cross-sectional view of the displaypanel 10 taken along the line B-B′ of FIG. 7B. In FIG. 13, likereference numerals as FIG. 9 denote like elements, and thus, redundantdescriptions thereof will be omitted for ease in explanation of thatfigure.

Referring to FIG. 13, the display panel 10 may include the penetratingportion PNP. The display panel 10 may include the substrate 100, thebuffer layer 111, the pixel circuit PC, the insulating layer IL, theorganic light-emitting diode OLED as a display element, and theencapsulation layer 300. The substrate 100 may include the first regionAR1 and the second region AR2, which are spaced apart from each otherwith the penetrating portion PNP therebetween.

The first side surface RS1 of the substrate 100, which is an edge of thefirst region AR1, and the second side surface RS2 of the substrate 100,which is an edge of the second region AR2, may define at least a portionof the penetrating portion PNP.

The substrate 100 may include the upper surface 100US facing the organiclight-emitting diode OLED and the lower surface 100LS opposite to theupper surface 100US. The first interval int1 between the first sidesurface RS1 and the second side surface RS2 from the upper surface 100USof the substrate 100 may be less than the second interval int2 betweenthe first side surface RS1 and the second side surface RS2 from thelower surface 100LS of the substrate 100.

The substrate 100 may include a base layer and a barrier layer on thebase layer. According to an embodiment, the substrate 100 may includethe first base layer 100 a, the first barrier layer 100 b, the secondbase layer 100 c, and the second barrier layer 100 d, which aresequentially stacked on each other in the stated order. According to anembodiment, the first base layer 100 a may include the first inclinedsurface ICS1 and the second inclined surface ICS2.

The first side surface RS1 and the second side surface RS2 mayrespectively include the first inclined surface ICS1 and the secondinclined surface ICS2. The first inclined surface ICS1 may overlap thefirst external region ER1 that is an edge region of the first regionAR1. The second inclined surface ICS2 may overlap the second externalregion ER2 that is an edge region of the second region AR2.

The substrate 100 may include the upper surface 100US facing the organiclight-emitting diode OLED and the lower surface 100LS opposite to theupper surface 100US. According to an embodiment, the first inclinedsurface ICS1 may be connected to the lower surface 100LS of thesubstrate 100 at the first region AR1. The second inclined surface ICS2may be connected to the lower surface 100LS of the substrate 100 at thesecond region AR2. According to an embodiment, the distance between thefirst inclined surface ICS1 and the second inclined surface ICS2 maydecrease in a direction from the lower surface 100LS of the substrate100 to the upper surface 100US of the substrate 100. In other words, thesubstrate 100 may include an inverted tapered shape based on thepenetrating portion PNP. Hereinafter, because the second region AR2 issimilar to the first region AR1, the first region AR1 will be mainlydescribed in detail.

The first base layer 100 a may include the upper surface 100 aUS of thefirst base layer 100 a, the lower surface 100 aLS of the first baselayer 100 a, and the first inclined surface ICS1.

The upper surface 100 aUS of the first base layer 100 a may face theorganic light-emitting diode OLED. The lower surface 100 aLS of thefirst base layer 100 a may be a surface opposite to the upper surface100 aUS of the first base layer 100 a.

The first inclined surface ICS1 may contact the lower surface 100 aLS ofthe first base layer 100 a. Also, the first inclined surface ICS1 maycontact the upper surface 100 aUS of the first base layer 100 a.

The first base layer 100 a may include the first base pattern 100 aP1and the second base pattern 100 aP2. The first base pattern 100 aP1 mayoverlap the first region AR1. The second base pattern 100 aP2 mayoverlap the second region AR2. The first base pattern 100 aP1 and thesecond base pattern 100 aP2 may be spaced apart from each other.

The first barrier layer 100 b may include the first barrier pattern 100bP1 and the second barrier pattern 100 bP2, which are spaced apart fromeach other. The first barrier pattern 100 bP1 may be arranged on thefirst base pattern 100 aP1. The second barrier pattern 100 bP2 may bearranged on the second base pattern 100 aP2.

According to an embodiment, the first barrier pattern 100 bP1 may bespaced apart from the first external region ER1. According to anembodiment, the second barrier pattern 100 bP2 may be spaced apart fromthe second external region ER2.

According to an embodiment, the shortest distance dis1 between the firstbarrier pattern 100 bP1 and the second barrier pattern 100 bP2 may begreater than the shortest distance dis2 between the first base pattern100 aP1 and the second base pattern 100 aP2.

The second base layer 100 c may contact at least a portion of the firstbase layer 100 a. According to an embodiment, the second base layer 100c may contact each of the first base pattern 100 aP1 and the second basepattern 100 aP2. Accordingly, the substrate 100 may have an enhancedadhesive force because the first base layer 100 a including an organicmaterial and the second base layer 100 c including an organic materialcontact each other.

FIG. 14 is a cross-sectional view for describing a method ofmanufacturing a display apparatus, according to another embodiment. FIG.14 is a cross-sectional view showing the support substrate SS takenalong a line C-C′ of FIG. 10A, and a multi-layer film formed on thesupport substrate SS. In FIG. 14, like reference numerals as FIG. 10Bdenote like elements, and thus, redundant descriptions thereof will beomitted for ease in explanation of that figure.

Referring to FIG. 14, the support substrate SS including the firstconcave portion CCP1 and the second concave portion CCP2 may beprepared, and the substrate 100 may be formed to overlap the firstconcave portion CCP1 and the second concave portion CCP2.

The substrate 100 may include the first base layer 100 a, the firstbarrier layer 100 b, the second base layer 100 c, and the second barrierlayer 100 d, which are sequentially stacked on each other in the statedorder. According to an embodiment, the substrate 100 may be thesubstrate 100 according to the sixth embodiment described with referenceto FIGS. 5A through 5C.

The second base layer 100 c may contact at least a portion of the firstbase layer 100 a. According to an embodiment, the second base layer 100c may contact each of the first base pattern 100 aP1 and the second basepattern 100 aP2. Accordingly, the substrate 100 may have an enhancedadhesive force because the first base layer 100 a including an organicmaterial and the second base layer 100 c including an organic materialcontact each other.

According to an embodiment, the support substrate SS may include thefirst concave portion CCP1 and the second concave portion CCP2, and thesubstrate 100 may overlap the first concave portion CCP1 and the secondconcave portion CCP2. Accordingly, an amount of substrate 100 etched inthe separated region V may be reduced. For example, an etched amount ofthe substrate 100 may be reduced by the depth SSdp of the first concaveportion CCP1 and/or the second concave portion CCP2. In particular, whenonly the second base layer 100 c and the second barrier layer 100 d areetched in the separated region V, the first upper surface SSUS1 of thesupport substrate SS may be exposed. Accordingly, the processing time ofthe display panel 10/display apparatus may be reduced.

The method of manufacturing a display apparatus performed thereafter issimilar to that described with reference to FIGS. 10B through 10E, andthus details thereof will be omitted for ease in explanation of thesefigures.

FIG. 15 is a perspective view of a display apparatus 2 according to anembodiment. FIGS. 16A through 16C are cross-sectional views of thedisplay apparatus 2, according to embodiments. FIG. 16A illustrates across sectional of the display apparatus 2 in an x-axis direction ofFIG. 15. FIG. 16B illustrates a cross sectional of the display apparatus2 in a y-axis direction of FIG. 15. FIG. 16C illustrates a cross sectionof the display apparatus 2 where a corner display area CDA is arrangedon both sides of a front display area FDA.

Referring to FIGS. 15 and 16A through 16C, the display apparatus 2 mayhave short sides in a first direction (for example, the x-axis or−x-axis direction) and long sides in a second direction (for example,the y-axis or −y-axis direction). According to another embodiment,lengths of sides of the display apparatus 2 in the first direction (forexample, the x-axis or −x-axis direction) and lengths of sides of thedisplay apparatus 2 in the second direction (for example, the y-axis or−y-axis direction) may be the same. According to another embodiment, thedisplay apparatus 2 may have long sides in the first direction (forexample, the x-axis or −x-axis direction) and short sides in the seconddirection (for example, the y-axis or −y-axis direction).

Corners where the short sides in the first direction (for example, thex-axis or −x-axis direction) and the long sides in the second direction(for example, the y-axis or −y-axis direction) meet may be curved in acertain curvature.

The display apparatus 2 may include a display panel 10-1 and a coverwindow 20-1. The cover window 20-1 may be arranged on the display panel10-1. The cover window 20-1 of FIG. 15 is similar to the cover window 20of FIG. 6, and thus details thereof will be omitted for ease inexplanation of that figure.

The display panel 10-1 may include a display area DA displaying an imageand a peripheral area PA surrounding the display area DA. The pluralityof pixels PX may be arranged in the display area DA and the image may bedisplayed through the plurality of pixels PX.

The display area DA may include the front display area FDA, a sidedisplay area SDA, the corner display area CDA, and a middle display areaMDA. The plurality of pixels PX arranged in each display area DA maydisplay the image.

The front display area FDA is a flat display area and a first pixel PX1including a display element may be arranged therein. According to anembodiment, the front display area FDA may provide most images.

The pixel PX including a display element may be arranged in the sidedisplay area SDA. Accordingly, the side display area SDA may display theimage. According to an embodiment, the side display area SDA may includea first side display area SDA1, a second side display area SDA2, a thirdside display area SDA3, and a fourth side display area SDA4. Accordingto some embodiments, at least one of the first side display area SDA1,the second side display area SDA2, the third side display area SDA3, andthe fourth side display area SDA4 may be omitted.

The first side display area SDA1 and the third side display area SDA3may be connected to the front display area FDA in the first direction(for example, the x-axis or −x-axis direction). For example, the firstside display area SDA1 may be connected in the −x-axis direction fromthe front display area FDA and the third side display area SDA3 may beconnected in the x-axis direction from the front display area FDA.

The first side display area SDA1 and the third side display area SDA3may be bent with a radius of curvature. According to an embodiment, thefirst side display area SDA1 and the third side display area SDA3 mayhave different radii of curvature. According to another embodiment, thefirst side display area SDA1 and the third side display area SDA3 mayhave a same radius of curvature. Hereinafter, a case where the radii ofcurvature of the first side display area SDA1 and third side displayarea SDA3 are the same, i.e., a first radius of curvature R1, will bemainly described in detail. Also, because the first side display areaSDA1 and the third side display area SDA3 are the same or similar, thefirst side display area SDA1 will be mainly described in detail.

The second side display area SDA2 and the fourth side display area SDA4may be connected to the front display area FDA in the second direction(for example, y-axis or −y-axis direction). For example, the second sidedisplay area SDA2 may be connected in the −y-axis direction from thefront display area FDA and the front display area FDA may be connectedin the y-axis direction from the front display area FDA.

The second side display area SDA2 and the fourth side display area SDA4may be bent with a radius of curvature. According to an embodiment, thesecond side display area SDA2 and the fourth side display area SDA4 mayhave different radii of curvature. According to another embodiment, thesecond side display area SDA2 and the fourth side display area SDA4 mayhave a same radius of curvature. Hereinafter, a case where the radii ofcurvature of the second side display area SDA2 and the fourth sidedisplay area SDA4 are the same, i.e., a second radius of curvature R2,will be mainly described in detail. Also, because the second sidedisplay area SDA2 and the fourth side display area SDA4 are the same orsimilar, the second side display area SDA2 will be mainly described indetail.

According to an embodiment, the first radius of curvature R1 of thefirst side display area SDA1 may be different from the second radius ofcurvature R2 of the second side display area SDA2. According to anotherembodiment, the first radius of curvature R1 of the first side displayarea SDA1 may be the same as the second radius of curvature R2 of thesecond side display area SDA2. Hereinafter, a case where the firstradius of curvature R1 is less than the second radius of curvature R2will be mainly described.

The corner display area CDA may be arranged at a corner CN of thedisplay panel 10-1 and/or the display apparatus 2 and bent. In otherwords, the corner display area CDA may be arranged to correspond to thecorner CN. Here, the corner CN may be a portion where the short side ofthe display apparatus 2 and/or display panel 10-1 in the first direction(for example, the x-axis or −x-axis direction) and the long side of thedisplay apparatus 2 and/or display panel 10-1 in the second direction(for example, the y-axis or −y-axis direction) meet. The corner displayarea CDA may be arranged between the neighboring side display areas SDA.For example, the corner display area CDA may be arranged between thefirst side display area SDA1 and the second side display area SDA2.Alternatively, the corner display area CDA may be arranged between thesecond side display area SDA2 and the third side display area SDA3,between the third side display area SDA3 and the fourth side displayarea SDA4, or between the fourth side display area SDA4 and the firstside display area SDA1. Accordingly, the side display area SDA and thecorner display area CDA may be bent while surrounding at least a portionof the front display area FDA.

A second pixel PX2 including a display element may be arranged in thecorner display area CDA. Accordingly, the corner display area CDA maydisplay the image.

When the first radius of curvature R1 of the first side display areaSDA1 and the second radius of curvature R2 of the second side displayarea SDA2 are different from each other, a radius of curvature at thecorner display area CDA may gradually change. According to anembodiment, when the first radius of curvature R1 of the first sidedisplay area SDA1 is less than the second radius of curvature R2 of thesecond side display area SDA2, the radius of curvature of the cornerdisplay area CDA may gradually increase in a direction from the firstside display area SDA1 to the second side display area SDA2. Forexample, a third radius of curvature R3 of the corner display area CDAmay be greater than the first radius of curvature R1 and less than thesecond radius of curvature R2.

The middle display area MDA may be arranged between the corner displayarea CDA and the front display area FDA. According to an embodiment, themiddle display area MDA may extend between the side display area SDA andthe corner display area CDA. For example, the middle display area MDAmay extend between the first side display area SDA1 and the cornerdisplay area CDA. Also, the middle display area MDA may extend betweenthe second side display area SDA2 and the corner display area CDA.

The middle display area MDA may include a third pixel PX3. According toan embodiment, a driving circuit for providing an electric signal and/ora power supply wire for providing a voltage may be provided in themiddle display area MDA, and the third pixel PX3 may overlap the drivingcircuit and the power supply wire. In this case, a display element ofthe third pixel PX3 may be arranged in an upper portion of the drivingcircuit and/or the power supply wire. According to some embodiments, thedriving circuit and/or the power supply wire may be arranged in theperipheral area PA and the third pixel PX3 may not overlap the drivingcircuit or the power supply wire.

The display apparatus 2 may display the image not only in the frontdisplay area FDA, but also in the side display area SDA, the cornerdisplay area CDA, and the middle display area MDA. Accordingly, aproportion occupied by the display area DA among the display apparatus 2may increase. Also, the display apparatus 2 includes the corner displayarea CDA that is bent at a corner and displays the image, and thus mayhave enhanced esthetics.

FIG. 17 is a plan view of the display panel 10-1 according to anembodiment. FIG. 17 is a plan view of a shape of the display panel 10-1before the corner display area CDA is bent, i.e., an unbent shape of thedisplay panel 10-1.

Referring to FIG. 17, the display panel 10-1 may include the displayarea DA and the peripheral area PA. The display area DA is an area wherethe plurality of pixels PX display an image, and the peripheral area PAis an area surrounding at least a portion of the display area DA.According to an embodiment, the peripheral area PA may entirely surroundthe display area DA. The display area DA may include the front displayarea FDA, the side display area SDA, the corner display area CDA, andthe middle display area MDA.

The display panel 10-1 may include the substrate 100 and a multi-layerfilm arranged on the substrate 100. Here, the display area DA and theperipheral area PA may be defined in the substrate 100 and/or themulti-layer film. In other words, the substrate 100 and/or themulti-layer film may include the front display area FDA, the sidedisplay area SDA, the corner display area CDA, the middle display areaMDA, and the peripheral area PA. Hereinafter, a case where the frontdisplay area FDA, the side display area SDA, the corner display areaCDA, the middle display area MDA, and the peripheral area PA are definedin the substrate 100 will be mainly described in detail.

The peripheral area PA may an area that does not provide an image andmay be a non-display area. A driving circuit DC for providing anelectric signal to the pixels PX, a power supply wire for providingpower, or the like may be arranged in the peripheral area PA. Forexample, the driving circuit DC may be a scan driving circuit providinga scan signal to each pixel PX via the scan line SL. Alternatively, thedriving circuit DC may be a data driving circuit providing a data signalto each pixel PX via the data line DL. According to an embodiment, thedata driving circuit may be arranged adjacent to one side surface of thedisplay panel 10-1. For example, the data driving circuit in theperipheral area PA may be arranged to correspond to the first sidedisplay area SDA1.

The peripheral area PA may include a pad portion that is a region wherean electronic device, a printed circuit board, or the like may beelectrically connected. The pad portion may be exposed without beingcovered by an insulating layer to be electrically connected to aflexible printed circuit board (FPCB). The FPCB may electrically connecta controller and the pad portion, and supply as signal or power receivedfrom the controller. According to some embodiments, the data drivingcircuit may be arranged on the FPCB.

The first pixel PX1 including a display element may be arranged in thefront display area FDA. The front display area FDA may be a flatportion. According to an embodiment, the front display area FDA mayprovide most images.

The pixel PX including a display element may be arranged in the sidedisplay area SDA, and the side display area SDA may be bent. In otherwords, as described above with reference to FIG. 15, the side displayarea SDA may be a region bent from the front display area FDA. The sidedisplay area SDA may include the first side display area SDA1, thesecond side display area SDA2, the third side display area SDA3, and thefourth side display area SDA4.

The first side display area SDA1 and the third side display area SDA3may extend from the front display area FDA in the first direction (forexample, the x-axis or −x-axis direction). Also, the second side displayarea SDA2 and the fourth side display area SDA4 may extend from thefront display area FDA in the second direction (for example, y-axis or−y-axis direction).

The corner display area CDA may be arranged at the corner CN of thedisplay panel 10-1. Here, the corner CN of the display panel 10-1 may bea portion where a short side in the first direction (for example, thex-axis or −x-axis direction) among an edge of the display panel 10-1 anda long side in the second direction (for example, the y-axis or −y-axisdirection) among the edge of the display panel 10-1 meet.

The corner display area CDA may be arranged between the neighboring sidedisplay areas SDA. For example, the corner display area CDA may bearranged between the first side display area SDA1 and the second sidedisplay area SDA2. Alternatively, the corner display area CDA may bearranged between the second side display area SDA2 and the third sidedisplay area SDA3, between the third side display area SDA3 and thefourth side display area SDA4, or between the fourth side display areaSDA4 and the first side display area SDA1.

The corner display area CDA may surround at least a portion of the frontdisplay area FDA. For example, the corner display area CDA may bearranged between the first side display area SDA1 and the second sidedisplay area SDA2 to surround at least a portion of the front displayarea FDA.

The second pixel PX2 including a display element may be arranged in thecorner display area CDA and the corner display area CDA may be bent. Inother words, as described above with reference to FIG. 15, the cornerdisplay area CDA may be arranged to correspond to the corner displayarea CDA and may be a region bent from the front display area FDA.

The middle display area MDA may be arranged between the front displayarea FDA and the corner display area CDA. According to an embodiment,the middle display area MDA may extend between the side display area SDAand the corner display area CDA. For example, the middle display areaMDA may extend between the first side display area SDA1 and the cornerdisplay area CDA and/or between the second side display area SDA2 andthe corner display area CDA. According to an embodiment the middledisplay area MDA may be bent.

The third pixel PX3 including a display element may be arranged in themiddle display area MDA. Also, according to an embodiment, the drivingcircuit DC providing an electric signal or a power supply wire providinga voltage may also be arranged in the middle display area MDA. Accordingto an embodiment, the driving circuit DC may be arranged along themiddle display area MDA and/or the peripheral area PA. In this case, thethird pixel PX3 arranged in the middle display area MDA may overlap thedriving circuit DC or the power supply wire. According to anotherembodiment, the third pixel PX3 may not overlap the driving circuit DCor the power supply wire. In this case, the driving circuit DC may bearranged along the peripheral area PA.

At least one of the side display area SDA, the corner display area CDA,and the middle display area MDA may be bent. In this case, the firstside display area SDA1 among the side display area SDA may be bent witha first radius of curvature, and the second side display area SDA2 amongthe side display area SDA may be bent with a second radius of curvature.When the first radius of curvature is less than the second radius ofcurvature, a radius of curvature for bending the corner display area CDAmay gradually increase in a direction from the first side display areaSDA1 to the second side display area SDA2.

When the corner display area CDA is bent, compressive strain may begreater than tensile strain in the corner display area CDA. In thiscase, a contractible substrate and a multi-layer film structure may needto be applied to the corner display area CDA. Accordingly, a stackstructure of a multi-layer film or the shape of the substrate 100arranged in the corner display area CDA may be different from a stackstructure of a multi-layer film or the shape of the substrate 100arranged in the front display area FDA.

FIG. 18 is an enlarged view of the corner CN of the display panel 10-1,according to an embodiment. FIG. 18 is an enlarged view of a region D ofFIG. 17. In FIG. 18, like reference numerals as FIG. 17 denote likeelements, and thus, redundant descriptions thereof will be omitted forease in explanation of that figure.

Referring to FIG. 18, the display panel 10-1 may include the corner CN.Here, the substrate 100 may include the front display area FDA, thefirst side display area SDA1, the second side display area SDA2, thecorner display area CDA, the middle display area MDA, and the peripheralarea PA. The corner display area CDA may be arranged at the corner CN ofthe display panel 10-1. Also, the corner display area CDA may bearranged between the front display area FDA and the peripheral area PA.The middle display area MDA may be arranged between the corner displayarea CDA and the front display area FDA.

The first pixel PX1 may be arranged in the front display area FDA. Thesecond pixel PX2 may be arranged in the corner display area CDA. Thedriving circuit DC and the third pixel PX3 overlapping the drivingcircuit DC may be arranged on the middle display area MDA. According tosome embodiments, the driving circuit DC may be omitted.

The substrate 100 may include a plurality of extending areas LA at leastpartially overlapping the corner display area CDA. The plurality ofextending areas LA may each extend in a direction away from the frontdisplay area FDA. In other words, the substrate 100 may include a bodyarea BA and the extending area LA. The body area BA may overlap thefront display area FDA, the first side display area SDA1, the secondside display area SDA2, and the middle display area MDA.

The plurality of extending areas LA may each extend in a direction awayfrom the body area BA. According to an embodiment, the plurality ofextending areas LA may overlap the corner display area CDA and theperipheral area PA. In this case, the second pixel PX2 may be arrangedon the extending area LA. The plurality of second pixels PX2 may bearranged in parallel along an extending direction of the extending areaLA.

The penetrating portion PNP may be defined between the adjacentextending areas LA. The penetrating portion PNP may penetrate thedisplay panel 10-1. When the corner display area CDA is bent at thecorner display area CDA, compressive strain may be greater than tensilestrain in the corner display area CDA. Because the penetrating portionPNP is defined between the adjacent extending areas LA, the plurality ofextending areas LA may contract. Accordingly, when the corner displayarea CDA is bent, the display panel 10-1 may be bent without damage.

FIG. 19 is a plan view of the body area BA and the extending area LAaccording to an embodiment.

Referring to FIG. 19, the display panel 10-1 may include the substrate100 and the pixel PX arranged on the substrate 100. The substrate 100may include the plurality of extending areas LA extending in a directionaway from the front display area FDA. In other words, the substrate 100may include the body area BA and the extending area LA. The body area BAmay overlap the middle display area MDA.

The plurality of extending areas LA may each extend in a direction awayfrom the body area BA. The extending area LA may extend in the directionaway from the front display area FDA. The extending area LA may at leastpartially overlap the corner display area CDA.

The extending area LA may extend along an extending direction EDR.According to an embodiment, the extending direction EDR may be adirection where the first direction (for example, the x-axis or −x-axisdirection) and the second direction (for example, the y-axis or −y-axisdirection) cross each other.

The extending area LA may include the first region AR1 and the secondregion AR2. According to an embodiment, the first region AR1 and thesecond region AR2 may at least partially overlap the corner display areaCDA.

According to an embodiment, the first region AR1 and the second regionAR2 may extend in a direction away from the front display area FDA.According to an embodiment, the first region AR1 and the second regionAR2 may extend in a direction away from the middle display area MDAand/or the body area BA.

According to an embodiment, the first region AR1 and the second regionAR2 may extend in different directions. According to another embodiment,the first region AR1 and the second region AR2 may extend in a samedirection. Hereinafter, a case where the first region AR1 and the secondregion AR2 extend in the same extending direction EDR will be mainlydescribed in detail.

The first region AR1 and the second region AR2 may be spaced apart fromeach other in a vertical direction VDR. According to an embodiment, thevertical direction VDR may be a direction perpendicular to the extendingdirection EDR.

The first region AR1 may include the first external region ER1 as anedge region. The first external region ER1 may extend along an edge ofthe first region AR1. The first external region ER1 may include thefirst side surface RS1 that is an edge of the first region AR1.

The second region AR2 may include the second external region ER2 as anedge region. The second external region ER2 may extend along an edge ofthe second region AR2. The second external region ER2 may include thesecond side surface RS2 that is an edge of the second region AR2.According to an embodiment, the first side surface RS1 and the secondside surface RS2 may face each other.

According to an embodiment, the first side surface RS1 and the secondside surface RS2 may respectively include the first inclined surface andthe second inclined surface. This will be described later.

The first region AR1 and the second region AR2 may be spaced apart fromeach other with the penetrating portion PNP therebetween. According toan embodiment, a component of the display panel 10-1 may not be arrangedbetween the first region AR1 and the second region AR2. In other words,the separated region V of the substrate 100 may be defined between thefirst region AR1 and the second region AR2. The separated region V mayoverlap the penetrating portion PNP.

The first side surface RS1 of the substrate 100, which is an edge of thefirst region AR1, and the second side surface RS2 of the substrate 100,which is an edge of the second region AR2, may define at least a portionof the penetrating portion PNP. Also, the first side surface RS1 of thesubstrate 100, which is an edge of the first region AR1, and the secondside surface RS2 of the substrate 100, which is an edge of the secondregion AR2, may define the separated region V.

The second pixel PX2 may be arranged in the corner display area CDA.According to an embodiment, the second pixel PX2 may be arranged inparallel along the extending direction EDR of the extending area LA.

The plurality of third pixels PX3 may be arranged in the middle displayarea MDA. According to an embodiment, the plurality of third pixels PX3may be arranged in parallel along the extending direction EDR of theextending area LA. In this case, the plurality of third pixels PX3 maybe arranged in parallel to the plurality of second pixels PX2.

The second pixel PX2 and the third pixel PX3 may each include the redsub-pixel Pr, the green sub-pixel Pg, and the blue sub-pixel Pb. The redsub-pixel Pr, the green sub-pixel Pg, and the blue sub-pixel Pb may emitred light, green light, and blue light, respectively.

A sub-pixel arrangement structure of the second pixel PX2 and asub-pixel arrangement structure of the third pixel PX3 may include anS-stripe structure. The second pixel PX2 and the third pixel PX3 mayeach include the red sub-pixel Pr, the green sub-pixel Pg, and the bluesub-pixel Pb.

The red sub-pixel Pr and the blue sub-pixel Pb may be arranged in afirst column 11, and the green sub-pixel Pg may be arranged in anadjacent second column 21. Here, the red sub-pixel Pr and the bluesub-pixel Pb may be arranged in a rectangular shape, and the greensub-pixel Pg may be arranged in a rectangular shape having long sides inthe vertical direction VDR. In other words, sides of the red sub-pixelPr and blue sub-pixel Pb may be arranged to face long sides of the greensub-pixel Pg. According to an embodiment, a length of a side of the redsub-pixel Pr in the vertical direction VDR perpendicular to theextending direction EDR may be less than a length of a side of the bluesub-pixel Pb in the vertical direction VDR.

According to another embodiment, the sub-pixel arrangement structure ofthe second pixel PX2 and the sub-pixel arrangement structure of thethird pixel PX3 may be a pentile type. According to another embodiment,the sub-pixel arrangement structure of the second pixel PX2 and thesub-pixel arrangement structure of the third pixel PX3 may be a stripetype.

FIG. 20 is a cross-sectional view of the display panel 10-1 according toan embodiment. FIG. 20 is a cross-sectional view of the display panel10-1 taken along a line E-E′ of FIG. 19. In FIG. 20, like referencenumerals as FIG. 9 denote like elements, and thus, redundantdescriptions thereof will be omitted for ease in explanation of thatfigure.

Referring to FIG. 20, the display panel 10-1 may include the penetratingportion PNP. Components of the display panel 10-1 may not be arranged inthe penetrating portion PNP. The penetrating portion PNP may be definedas an edge of the components of the display panel 10-1. For example, thepenetrating portion PNP may be defined as an edge of the substrate 100.

The display panel 10-1 may include the substrate 100, the buffer layer111, the pixel circuit PC, the insulating layer IL, the organiclight-emitting diode OLED as a display element, and the encapsulationlayer 300. The substrate 100 may include the first region AR1 and thesecond region AR2, which are spaced apart from each other with thepenetrating portion PNP therebetween.

The first side surface RS1 of the substrate 100, which is an edge of thefirst region AR1, and the second side surface RS2 of the substrate 100,which is an edge of the second region AR2, may define at least a portionof the penetrating portion PNP. According to an embodiment, a spacebetween the first side surface RS1 and the second side surface RS2,which face each other, may be defined as the separated region V of thesubstrate 100. The separated region V may overlap the penetratingportion PNP.

The substrate 100 may include the upper surface 100US facing the organiclight-emitting diode OLED and the lower surface 100LS opposite to theupper surface 100US. The first interval int1 between the first sidesurface RS1 and the second side surface RS2 from the upper surface 100USof the substrate 100 may be less than the second interval int2 betweenthe first side surface RS1 and the second side surface RS2 from thelower surface 100LS of the substrate 100. The first interval int1 may bean interval from the first point 100P1, where the upper surface 100US ofthe substrate 100 and the first side surface RS1 contact each other, tothe second point 100P2, where the upper surface 100US of the substrate100 and the second side surface RS2 contact each other. The secondinterval int2 may be an interval from the third point 100P3, where thelower surface 100LS of the substrate 100 and the first side surface RS1contact each other, to the fourth point 100P4, where the lower surface100LS of the substrate 100 and the second side surface RS2 contact eachother.

The substrate 100 may include a base layer and a barrier layer on thebase layer. According to an embodiment, the substrate 100 may includethe first base layer 100 a, the first barrier layer 100 b, the secondbase layer 100 c, and the second barrier layer 100 d, which aresequentially stacked on each other in the stated order. According to anembodiment, the first base layer 100 a may include the first inclinedsurface ICS1 and the second inclined surface ICS2.

The first side surface RS1 and the second side surface RS2 mayrespectively include the first inclined surface ICS1 and the secondinclined surface ICS2. The first inclined surface ICS1 may overlap thefirst external region ER1 that is an edge region of the first regionAR1. The second inclined surface ICS2 may overlap the second externalregion ER2 that is an edge region of the second region AR2.

According to an embodiment, the first inclined surface ICS1 may beconnected to the lower surface 100LS of the substrate 100 at the firstregion AR1. The second inclined surface ICS2 may be connected to thelower surface 100LS of the substrate 100 at the second region AR2.According to an embodiment, the distance between the first inclinedsurface ICS1 and the second inclined surface ICS2 may decrease in adirection from the lower surface 100LS of the substrate 100 to the uppersurface 100US of the substrate 100. In other words, the substrate 100may include an inverted tapered shape based on the penetrating portionPNP.

The first base layer 100 a may include the upper surface 100 aUS of thefirst base layer 100 a, the lower surface 100 aLS of the first baselayer 100 a, the first inclined surface ICS1, and the first surface SS1of the first base layer 100 a.

The upper surface 100 aUS of the first base layer 100 a may face theorganic light-emitting diode OLED. The lower surface 100 aLS of thefirst base layer 100 a may be a surface opposite to the upper surface100 aUS of the first base layer 100 a. The first inclined surface ICS1may contact the lower surface 100 aLS of the first base layer 100 a.

The first surface SS1 of the first base layer 100 a may cross the uppersurface 100 aUS of the first base layer 100 a and the first inclinedsurface ICS1. The first surface SS1 of the first base layer 100 a maycontact the upper surface 100 aUS of the first base layer 100 a and thefirst inclined surface ICS1. For example, one side of the first surfaceSS1 of the first base layer 100 a may contact the upper surface 100 aUSof the first base layer 100 a, and the other side of the first surfaceSS1 of the first base layer 100 a may contact the first inclined surfaceICS1. The first surface SS1 of the first base layer 100 a may be asurface formed via an etching process.

The buffer layer 111 may be arranged on the substrate 100.

The pixel circuit PC may include the driving thin-film transistor T1,the switching thin-film transistor T2, and the storage capacitor Cst.

The insulating layer IL may include the first gate insulating layer 112,the second gate insulating layer 113, the interlayer insulating layer114, the first inorganic layer PVX1, the first organic insulating layer115, the second organic insulating layer 116, and the second inorganiclayer PVX2.

The organic light-emitting diode OLED may be arranged on the secondorganic insulating layer 116. The organic light-emitting diode OLED mayinclude the first organic light-emitting diode OLED1 and the secondorganic light-emitting diode OLED2. The first organic light-emittingdiode OLED1 may overlap the first region AR1, as the first displayelement. The second organic light-emitting diode OLED2 may overlap thesecond region AR2, as the second display element.

The first organic light-emitting diode OLED1 may include the first pixelelectrode 211A, the intermediate layer 212, and the opposing electrode213. The second organic light-emitting diode OLED2 may include thesecond pixel electrode 211B, the intermediate layer 212, and theopposing electrode 213.

The first inorganic encapsulation layer 310 may cover the organiclight-emitting diode OLED. The first inorganic encapsulation layer 310may entirely and continuously cover the substrate 100. The firstinorganic encapsulation layer 310 may cover the first organiclight-emitting diode OLED1, the hole HL, the first dam portion DAM1, thesecond dam portion DAM2, and the second organic light-emitting diodeOLED2. The first inorganic encapsulation layer 310 may contact theprotruding tip PT of the second inorganic layer PVX2. The firstinorganic encapsulation layer 310 may contact the first inorganic layerPVX1. Accordingly, moisture or oxygen may be prevented from beingintroduced from the penetrating portion PNP to the organiclight-emitting diode OLED through a layer including an organic material.

The organic encapsulation layer 320 may be arranged on the firstinorganic encapsulation layer 310. The organic encapsulation layer 320may overlap the first organic light-emitting diode OLED1 and the secondorganic light-emitting diode OLED2, and may fill the hole HL. Accordingto an embodiment, the organic encapsulation layer 320 may be separatedbased on the penetrating portion PNP. Because the first dam portion DAM1and the second dam portion DAM2 protrude in the thickness direction ofthe substrate 100 from the upper surface of the second inorganic layerPVX2, a flow of the organic encapsulation layer 320 may be controlled.

The second inorganic encapsulation layer 330 may cover the organicencapsulation layer 320. The second inorganic encapsulation layer 330may entirely and continuously cover the substrate 100. The secondinorganic encapsulation layer 330 may contact the first inorganicencapsulation layer 310 on the first dam portion DAM1 and the second damportion DAM2. Accordingly, the organic encapsulation layer 320 may beseparated by the first dam portion DAM1 and the second dam portion DAM2.

According to an embodiment, the penetrating portion PNP may be definedin the display panel 10-1 and enhance flexibility of the display panel10-1. The penetrating portion PNP may be defined by the first sidesurface RS1 of the substrate 100, which is the edge of the first regionAR1, and the second side surface RS2 of the substrate 100, which is theedge of the second region AR2. The first side surface RS1 and the secondside surface RS2 may respectively include the first inclined surfaceICS1 and the second inclined surface ICS2.

According to an embodiment, the first interval int1 may be less than thesecond interval int2, and the substrate 100 includes the first inclinedsurface ICS1 and the second inclined surface ICS2. Accordingly, theamount of substrate 100 etched in the separated region V may be reduced,thereby reducing the processing time of the display panel 10-1.

FIG. 21A is a plan view for describing a method of manufacturing adisplay apparatus according to an embodiment. FIGS. 21B through 21D arecross-sectional views for describing a method of manufacturing a displayapparatus according to an embodiment of the disclosure. FIGS. 21Bthrough 21D are cross-sectional views showing the support substrate SStaken along a line F-F′ of FIG. 21A, and a multi-layer film formed onthe support substrate SS. In FIGS. 21A through 21D, like referencenumerals as FIGS. 10A through 10E denote like elements, and thus,redundant descriptions thereof will be omitted for ease in explanationof these figures.

Referring to FIG. 21A, the support substrate SS including the firstconcave portion CCP1 and the second concave portion CCP2 may beprepared. The support substrate SS may further include a front concaveportion FCCP. The front concave portion FCCP may be integrated with thefirst concave portion CCP1 and the second concave portion CCP2. Thefirst concave portion CCP1 and the second concave portion CCP2 mayextend in a direction away from the front concave portion FCCP.

The substrate 100 overlapping the first concave portion CCP1 and thesecond concave portion CCP2 may be formed on the support substrate SS.The substrate 100 may include the body area BA, the first region AR1,the second region AR2, and the separated region V. The body area BA mayoverlap the front concave portion FCCP.

The first region AR1 may overlap the first concave portion CCP1. Thefirst region AR1 may include the first external region ER1 that is anedge region. The first external region ER1 may extend along the edge ofthe first region AR1. The first external region ER1 may contact theseparated region V.

The second region AR2 may overlap the second concave portion CCP2. Thesecond region AR2 may include the second external region ER2 that is anedge region. The second external region ER2 may extend along the edge ofthe second region AR2. The second external region ER2 may contact theseparated region V.

Referring to FIG. 21B, the substrate 100 may include the first baselayer 100 a, the first barrier layer 100 b, the second base layer 100 c,and the second barrier layer 100 d, which are sequentially stacked oneach other in the stated order. According to an embodiment, thesubstrate 100 may be the substrate 100 according to the secondembodiment described with reference to FIG. 2A. According to anotherembodiment, the substrate 100 may be one of the substrate 100 accordingto the first embodiment described with reference to FIGS. 1A through 1C,the substrate 100 according to the third embodiment described withreference to FIG. 2B, the substrate 100 according to the fourthembodiment described with reference to FIGS. 3A through 3D, thesubstrate 100 according to the fifth embodiment described with referenceto FIG. 4, and the substrate 100 according to the sixth embodimentdescribed with reference to FIGS. 5A through 5C. Hereinafter, a case inwhich the substrate 100 is the substrate 100 according to the secondembodiment described with reference to FIG. 2A will be mainly described.

According to an embodiment, the support substrate SS may include thefirst concave portion CCP1 and the second concave portion CCP2, and thesubstrate 100 may overlap the first concave portion CCP1 and the secondconcave portion CCP2. Accordingly, a thickness of the substrate 100 mayvary according to regions. For example, the thickness 100 t 1 of thesubstrate 100 in the first region AR1 may be greater than the thickness100 t 2 of the substrate 100 between the first region AR1 and the secondregion AR2.

Referring to FIG. 21C, a portion of the substrate 100 overlapping thefirst upper surface SSUS1 of the support substrate SS may be removed. Inother words, a portion of the substrate 100 overlapping the separatedregion V may be removed. Accordingly, the first upper surface SSUS1 ofthe support substrate SS may be externally exposed.

The penetrating portion PNP may be formed when the portion of thesubstrate 100 overlapping the first upper surface SSUS1 of the supportsubstrate SS is removed. The first side surface RS1 of the substrate100, which is an edge of the first region AR1, and the second sidesurface RS2 of the substrate 100, which is an edge of the second regionAR2, may define at least a portion of the penetrating portion PNP.

According to an embodiment, the support substrate SS may include thefirst concave portion CCP1 and the second concave portion CCP2, and thesubstrate 100 may overlap the first concave portion CCP1 and the secondconcave portion CCP2. Accordingly, an amount of substrate 100 etched inthe separated region V may be reduced. For example, an amount ofsubstrate 100 etched by a depth SSdp of the first concave portion CCP1and/or the second concave portion CCP2 may be reduced, and a processingtime of the display panel and/or a display apparatus may be reduced.

Next, the intermediate layer 212 and the opposing electrode 213 may beformed on the substrate 100. Accordingly, the first organiclight-emitting diode OLED1 and the second organic light-emitting diodeOLED2 may be formed. Next, the encapsulation layer 300 may be formed.

According to an embodiment, the support substrate SS may include thefirst concave portion CCP1 overlapping the first region AR1 and thesecond concave portion CCP2 overlapping the second region AR2.Accordingly, the depth of the penetrating portion PNP may be definedfrom the upper surface of the encapsulation layer 300 to the first uppersurface SSUS1 of the support substrate SS.

Compared to a case where the support substrate SS does not include thefirst concave portion CCP1 and the second concave portion CCP2, theheight from the upper surface SSUS of the support substrate SS to theupper surface of the encapsulation layer 300 may be decreased by thedepth SSdp of the first concave portion CCP1 and/or the second concaveportion CCP2. Accordingly, the process difficulty level caused by thedepth of the penetrating portion PNP may be reduced.

Then, the substrate 100 may be detached from the support substrate SS.According to an embodiment, the substrate 100 may be separated from thesupport substrate SS according to laser release of irradiating a laserbeam onto the substrate 100.

The first interval int1 between the first side surface RS1 and thesecond side surface RS2 from the upper surface 100US of the substrate100 may be less than the second interval int2 between the first sidesurface RS1 and the second side surface RS2 from the lower surface 100LSof the substrate 100. Also, the first side surface RS1 and the secondside surface RS2 may respectively include the first inclined surfaceICS1 and the second inclined surface ICS2. Accordingly, the substrate100 may be easily detached from the support substrate SS.

Referring to FIG. 21D, the manufactured display panel 10-1 may be bent.In particular, the corner display area CDA overlapping the corner CN ofthe manufactured display panel 10-1 may be bent. According to anembodiment, the corner display area CDA may have the third radius ofcurvature R3. According to an embodiment, the corner display area CDAmay be bent in a vacuum state after a guide film is arranged below themanufactured display panel 10-1. According to an embodiment, the cornerdisplay area CDA may be bent via a thermoforming method.

Then, the cover window 20-1 may be arranged on the display panel 10-1manufactured as above. The manufactured display panel 10-1 may beadhered to the cover window 20-1. According to an embodiment, themanufactured display panel 10-1 may be connected to the cover window20-1 via an optical transparent adhesive. The manufactured display panel10-1 may be adhered to the cover window 20-1 via a lamination process.As such, the cover window 20-1 may be arranged on the corner displayarea CDA.

FIG. 22 is a perspective view of a display apparatus 3 according to anembodiment. In FIG. 22, like reference numerals as FIG. 15 denote likeelements, and thus, redundant descriptions thereof will be omitted forease in explanation of that figure.

Referring to FIG. 22, the display apparatus 3 may include a displaypanel 10-2. The display panel 10-2 may include a component area CA, thedisplay area DA and the peripheral area PA.

The component area CA realizes an image and a component may be arrangedtherein. An auxiliary pixel Pa and a plurality of transmission areas TAmay be arranged in the component area CA. The auxiliary pixel Pa mayinclude an auxiliary display element. According to an embodiment, theauxiliary pixel Pa may be arranged between the adjacent transmissionareas TA.

The display area DA may realize an image. The display area DA maysurround at least a portion of the component area CA. According to anembodiment, the display area DA may entirely cover the component areaCA. A main pixel Pm may be arranged in the display area DA. The mainpixel Pm may include a main display element. According to an embodiment,the plurality of main pixels Pm may be arranged in the display area DA.

FIG. 23 is a cross-sectional view of the display apparatus 3, accordingto an embodiment.

Referring to FIG. 23, the display apparatus 3 may include the displaypanel 10-2, a cover window 20-2, and a component 30.

The display panel 10-2 may include the substrate 100 and a multi-layerfilm arranged on the substrate 100. According to an embodiment, thedisplay panel 10-2 may include the substrate 100, a bottom metal layerBML, the buffer layer 111, the insulating layer IL, the encapsulationlayer 300, a touch electrode layer 400, and an optical functional layer500.

The display area DA and the component area CA may be defined in thesubstrate 100 and/or the multi-layer film. In other words, the displayarea DA and the component area CA may be defined in the substrate 100and/or the multi-layer film. Hereinafter, a case where the display areaDA and the component area CA are defined in the substrate 100 will bemainly described in detail.

According to an embodiment, the substrate 100 may be the substrate 100according to the second embodiment described with reference to FIG. 2A.According to another embodiment, the substrate 100 may be one of thesubstrate 100 according to the first embodiment described with referenceto FIGS. 1A through 1C, the substrate 100 according to the thirdembodiment described with reference to FIG. 2B, the substrate 100according to the fourth embodiment described with reference to FIGS. 3Athrough 3D, the substrate 100 according to the fifth embodimentdescribed with reference to FIG. 4, and the substrate 100 according tothe sixth embodiment described with reference to FIGS. 5A through 5C.Hereinafter, a case in which the substrate 100 is the substrate 100according to the second embodiment described with reference to FIG. 2Awill be mainly described.

The substrate 100 may include the first base layer 100 a, the firstbarrier layer 100 b, the second base layer 100 c, and the second barrierlayer 100 d, which are sequentially stacked on each other in the statedorder. According to an embodiment, the first base layer 100 a mayinclude the first inclined surface ICS1 and the second inclined surfaceICS2. According to an embodiment, the first inclined surface ICS1 andthe second inclined surface ICS2 may define a groove GV. Accordingly, athickness of the substrate 100 may vary according to regions. Forexample, the thickness 100 t 2 of the substrate 100 at the groove GV maybe less than the thickness 100 t 1 of the substrate 100 at the displayarea DA.

The main pixel Pm may be arranged in the display area DA. The main pixelPm may include a main pixel circuit PCm and a main organiclight-emitting diode OLEDm connected thereto. The main pixel circuit PCmmay include at least one main thin-film transistor TFTm.

The component area CA may include the plurality of transmission areas TAand the auxiliary pixel Pa may be arranged between the adjacenttransmission areas TA. The auxiliary pixel Pa may include an auxiliarypixel circuit PCa and an auxiliary organic light-emitting diode OLEDaconnected thereto. The auxiliary pixel circuit PCa may include at leastone auxiliary thin-film transistor TFTa. In other words, the auxiliaryorganic light-emitting diode OLEDa may be arranged on the component areaCA and spaced apart from the transmission area TA.

The plurality of transmission areas TA may overlap the component 30.FIG. 23 illustrates only one transmission area TA. The plurality oftransmission areas TA may be a region where a light/signal emitted fromthe component 30 or a light/signal incident on the component 30 istransmitted.

According to an embodiment, the groove GV may overlap the transmissionarea TA and face the component 30. According to an embodiment, the firstinclined surface ICS1 and the second inclined surface ICS2 may face thecomponent 30. Accordingly, because a thickness of the first base layer100 a at the groove GV is less than a thickness of the first base layer100 a at the display area DA, light transmittance in the transmissionarea TA may be enhanced.

The bottom metal layer BML may be arranged in the component area CA. Thebottom metal layer BML may be arranged to correspond to a bottom of theauxiliary thin-film transistor TFTa. The bottom metal layer BML mayprevent an external light from reaching the auxiliary thin-filmtransistor TFTa. According to some embodiments, a constant voltage orsignal may be applied to the bottom metal layer BML, thereby preventingdamage to a pixel circuit caused by electrostatic discharge. In FIG. 23,the bottom metal layer BML is arranged on the substrate 100 butaccording to some embodiments, the bottom metal layer BML may beinserted into the substrate 100.

The encapsulation layer 300 may cover the auxiliary organiclight-emitting diode OLEDa and the main organic light-emitting diodeOLEDm. According to an embodiment, the encapsulation layer 300 mayinclude at least one inorganic encapsulation layer and at least oneorganic encapsulation layer. The at least one inorganic encapsulationlayer may include at least one inorganic material from among Al2O3,TiO2, Ta2O5, ZnO, SiO2, SiNx, and SiON. The at least one organicencapsulation layer may include a polymer-based material. Examples ofthe polymer-based material may include an acrylic resin, an epoxy resin,polyimide, and/or polyethylene. According to an embodiment, the at leastone organic encapsulation layer may include acrylate.

According to another embodiment, the encapsulation layer 300 may have astructure in which the substrate 100 and an upper substrate of atransparent member are combined via a sealing member, thereby sealing aninternal space between the substrate 100 and the upper substrate. Here,a moisture absorbent or filler may be located in the internal space. Thesealing member may be a sealant, and according to another embodiment,the sealing member may include a material hardened by a laser beam. Forexample, the sealing member may be a frit. In detail, the sealing membermay include a urethane-based resin, an epoxy-based resin, or anacryl-based resin, which is an organic sealant, or a silicone that is aninorganic sealant. The urethane-based resin may use, for example,urethane acrylate. The acryl-based resin may use, for example, butylacrylate or ethylhexyl acrylate. Meanwhile, the sealing member mayinclude a material hardened by heat.

The touch electrode layer 400 may be arranged on the encapsulation layer300. The touch electrode layer 400 may obtain coordinate informationaccording to an external input, for example, a touch event.

The optical functional layer 500 may be arranged on the touch electrodelayer 400. The optical functional layer 500 may reduce reflectance of alight (external light) incident from the outside towards the displayapparatus 3, and/or enhance color purity of a light emitted from thedisplay apparatus 3.

According to an embodiment, the optical functional layer 500 may includean opening 5000P overlapping the plurality of transmission areas TA.Accordingly, light transmittance of the plurality of transmission areasTA may be enhanced. A transparent material, such as an optically clearresin (OCR), may be filled in the opening 5000P overlapping theplurality of transmission areas TA.

The cover window 20-2 may be arranged on the display panel 10-2. Thecover window 20-2 may be adhered to the display panel 10-2 by atransparent adhesive member, such as an optically clear adhesive (OCA).The cover window 20-2 of FIG. 23 is similar to the cover window 20 ofFIG. 6, and thus details thereof will be omitted for ease in explanationof that figure.

The component 30 may overlap the component area CA. The component 30 mayinclude an electronic element. For example, the component 30 may be anelectronic element using light or sound. For example, the electronicelement may include a sensor receiving and using a light, such as aninfrared sensor, a camera capturing an image by receiving a light, asensor measuring a distance by outputting and detecting a light orsound, or recognizing a fingerprint, a small lamp outputting a light, ora speaker outputting sound. The electronic element using light may uselight of various wavelength bands, such as visible light, infraredlight, or ultraviolet light.

As described above, a display panel according to an embodiment may beflexible by including a first side surface and a second side surface,which define a penetrating portion, and may have enhanced reliabilitybecause a distance between the first side surface and the second sidesurface at an upper surface of a substrate is less than a distancebetween the first side surface and the second side surface at a lowersurface of the substrate.

Also, a display apparatus according to an embodiment of the disclosuremay have enhanced light transmittance in a transmission area because athickness of a first base layer at a groove is less than a thickness ofthe first base layer at a display area.

In addition, in a method of manufacturing a display apparatus, accordingto an embodiment, the display apparatus having enhanced reliability maybe manufactured by forming a substrate overlapping a first concaveportion and a second concave portion on a support substrate includingthe first concave portion and the second concave portion.

Although certain embodiments and implementations have been describedherein, other embodiments and modifications will be apparent from thisdescription. Accordingly, the inventive concepts are not limited to suchembodiments, but rather to the broader scope of the appended claims andvarious obvious modifications and equivalent arrangements as would beapparent to a person of ordinary skill in the art.

What is claimed is:
 1. A display panel including a penetrating portion,the display panel comprising: a substrate including a first region and asecond region, which are spaced apart from each other with thepenetrating portion provided therebetween; and a display elementarranged on the substrate and including a first display elementoverlapping the first region and a second display element overlappingthe second region, wherein a first side surface of the substrate thatcorresponds to an edge of the first region, and a second side surface ofthe substrate that corresponds to an edge of the second region,respectively define at least first and second portions of thepenetrating portion, and an interval between the first side surface andthe second side surface closest to an upper surface of the substratethat faces the display element, is less than an interval between thefirst side surface and the second side surface closest to a lowersurface of the substrate, the lower surface being opposite to the uppersurface of the substrate and does not face the display element.
 2. Thedisplay panel of claim 1, wherein the substrate comprises a first baselayer and a first barrier layer arranged on the first base layer, andthe first side surface and the second side surface respectively comprisea first inclined surface of the first base layer and a second inclinedsurface of the first base layer.
 3. The display panel of claim 2,wherein the first base layer further comprises an upper surface of thefirst base layer that faces the display element, a lower surface of thefirst base layer and that is opposite to the upper surface of the firstbase layer and connected to the first inclined surface, and a firstsurface connected to the upper surface of the first base layer and thefirst inclined surface and crossing the first inclined surface and theupper surface of the first base layer.
 4. The display panel of claim 2,wherein the first base layer further comprises an upper surface of thefirst base layer that faces the display element, and a lower surface ofthe first base layer that is opposite to the upper surface of the firstbase layer and that is connected to the first inclined surface, whereinthe first inclined surface is connected to the upper surface of thefirst base layer.
 5. The display panel of claim 2, wherein the substratefurther comprises a second base layer and second barrier layer thatcover the first barrier layer, wherein the second base layer contacts atleast a portion of the first base layer.
 6. The display panel of claim2, wherein the first base layer comprises a first base patternoverlapping the first region and a second base pattern overlapping thesecond region and spaced apart from the first base pattern, the firstbarrier layer comprises a first barrier pattern arranged on the firstbase pattern and a second barrier pattern arranged on the first baselayer and spaced apart from the first barrier pattern, and a shortestdistance between the first barrier pattern and the second barrierpattern is less than a shortest distance between the first base patternand the second base pattern.
 7. The display panel of claim 2, wherein adistance between the first inclined surface and the second inclinedsurface decreases in a direction from a lower surface of the first baselayer towards an upper surface of the first base layer.
 8. The displaypanel of claim 1, further comprising an encapsulation layer covering thedisplay element and including at least one inorganic encapsulation layerand at least one organic encapsulation layer, wherein the at least oneorganic encapsulation layer includes a first organic encapsulation layerregion and a second organic encapsulation layer region separated fromeach other based on the penetrating portion being disposed therebetween.9. The display panel of claim 1, wherein the first region comprises afirst center region, a first connection region extending from the firstcenter region in a first direction, and a second connection regionextending in a second direction crossing the first direction, and one ofthe first connection region and the second connection region extendsfrom the first center region to the second region.
 10. The display panelof claim 1, wherein the substrate comprises a front display area, afirst side display area extending from the front display area in a firstdirection, a second side display area extending from the front displayarea in a second direction crossing the first direction, and a cornerdisplay area arranged between the first side display area and the secondside display area, the first region and the second region at leastpartially overlap the corner display area, and the first region and thesecond region extend in a direction away from the front display area.11. A display apparatus comprising: a substrate comprising a componentarea including a transmission area, and a display area surrounding atleast a portion of the component area; a display element arranged on thecomponent area and spaced apart from the transmission area; and acomponent overlapping the component area, wherein the substrate furthercomprises a first base layer and a first barrier layer arranged on thefirst base layer, the first base layer comprises an inclined surfacedefining a groove that overlaps the transmission area and that faces thecomponent, and a thickness of the first base layer in the groove is lessthan a thickness of the first base layer in the display area.
 12. Amethod of manufacturing a display apparatus, the method comprising:preparing a support substrate including a first concave portion and asecond concave portion; forming, on the support substrate, a substrateoverlapping the first concave portion and the second concave portion;forming, on the substrate, a first pixel electrode overlapping the firstconcave portion and a second pixel electrode overlapping the secondconcave portion; and detaching the substrate from the support substrate.13. The method of claim 12, wherein the forming of the substratecomprises: forming a first base layer that fills the first concaveportion and the second concave portion; and forming a first barrierlayer on the first base layer.
 14. The method of claim 13, furthercomprising forming a first base pattern arranged on the first concaveportion and a second base pattern arranged on the second concave portionand spaced apart from the first base pattern by removing at least aportion of the first base layer.
 15. The method of claim 14, wherein theforming of the first barrier layer comprises forming a first barrierpattern overlapping the first concave portion and a second barrierpattern overlapping the second concave portion and spaced apart from thefirst barrier pattern.
 16. The method of claim 15, further comprisingforming a second base layer to contact the first base layer.
 17. Themethod of claim 12, wherein the preparing of the support substratecomprises forming the first concave portion and the second concaveportion on an upper surface of the support substrate.
 18. The method ofclaim 12, further comprising removing a portion of the substrate thatoverlaps a first upper surface of the support substrate and that isarranged between the first concave portion and the second concaveportion.
 19. The method of claim 12, wherein the first concave portioncomprises a first center portion, a first connection portion extendingfrom the first center portion in a first direction, and a secondconnection portion extending in a second direction crossing the firstdirection, and one of the first connection portion and the secondconnection portion extends from the first center portion towards thesecond concave portion.
 20. The method of claim 12, wherein the supportsubstrate further comprises a front concave portion integrated with thefirst concave portion and the second concave portion, and the firstconcave portion and the second concave portion extend in a directionaway from the front concave portion.